검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Recent advances in nano-conductive adhesives Lu DD, Li YG, Wong CP Journal of Adhesion Science and Technology, 22(8-9), 815, 2008 |
| 2 |
Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications Lin YC, Chen X Journal of Adhesion Science and Technology, 22(14), 1631, 2008 |
| 3 |
이방성 전도 접착제 물성과 유기 기판 플립 칩의 신뢰성에 미치는 비전도성 충진재의 영향 임명진, 백경욱 Korean Journal of Materials Research, 10(3), 184, 2000 |