Nano-conductive adhesives have been attracting more and more interest in microelectronic packaging field due to their unique electrical and mechanical properties compared to conventional conductive adhesives. There has been extensive research on nano-conductive adhesives which contain nano-fillers such as nano-particles, nano-wires or carbon nano-tubes. This paper provides a comprehensive review of most recent advances in nano-conductive adhesives. (C) Koninklijke Brill NV, Leiden, 2008.