1 |
Growth mechanism evolvement influence on out-of -planetexture of Y2O3 seed layer for coated conductors Xia YD, Tao BW, Xiong J, Zhang X, Zhao Y Journal of Crystal Growth, 438, 5, 2016 |
2 |
Effect of twins in Ni substrates on the microstructure of La2Zr2O7 films for coated conductors Petit S, Pairis S, Mikolajczyk M, Ortega L, Soubeyroux JL, Odier P Thin Solid Films, 531, 545, 2013 |
3 |
Fractal analysis and atomic force microscopy measurements of surface roughness for Hastelloy C276 substrates and amorphous alumina buffer layers in coated conductors Feng F, Shi K, Xiao SZ, Zhang YY, Zhao ZJ, Wang Z, Wei JJ, Han Z Applied Surface Science, 258(8), 3502, 2012 |
4 |
MgB2 coated superconducting tapes with high critical current densities fabricated by hybrid physical-chemical vapor deposition Ranot M, Kang WN Current Applied Physics, 12(2), 353, 2012 |
5 |
An orientation competition in yttria-stabilized zirconia thin films fabricated by ion beam assisted sputtering deposition Wang Z, Zhao ZJ, Yan BJ, Li YL, Feng F, Shi K, Han Z Thin Solid Films, 520(3), 1115, 2011 |
6 |
Effects of ion energy on ion beam assisted deposition textured yttria stabilized zirconia buffer layer of coated conductor Wang Z, Shi K, Chen H, Feng F, Sun JC, Han Z Thin Solid Films, 517(6), 2044, 2009 |
7 |
Growth of thick chemical solution derived pyrochlore La2Zr2O7 buffer layers for YBa2Cu3O7-x coated conductors Knoth K, Huhne R, Oswald S, Molina L, Eibl O, Schultz L, Holzapfel B Thin Solid Films, 516(8), 2099, 2008 |
8 |
Electrochemical Analysis of Potentials and Nucleation Mechanism for (Tl0.8Pb0.2Bi0.2) (Sr0.9Ba0.1)2 Ca2.2Cu3Ox Films in Dimethyl Sulfoxide (DMSO) Kim YH, Jeong DY, Chung UC, Park H, Chun HH, Chung WS Journal of Industrial and Engineering Chemistry, 13(2), 279, 2007 |
9 |
Development of cube-textured Ni and Ni-W alloy tapes by focused infrared heating Chung JK, Bae SY, Lee SG, Park C, Yoo SI, Kim CJ Materials Science Forum, 510-511, 258, 2006 |
10 |
YBCO coated conductor applications - A texture problem Obst B, Nast R, Kotzyba G, Goldacker W Materials Science Forum, 495-497, 1353, 2005 |