| 1 |
Electroless copper deposition: A critical review
Ghosh S
Thin Solid Films, 669, 641, 2019 |
| 2 |
Electrochemical synthesis of highly ordered polypyrrole on copper modified aluminium substrates
Siddaramanna A, Saleema N, Sarkar DK
Applied Surface Science, 307, 589, 2014 |
| 3 |
Low temperature ordering and high (001) orientation of [Fe/Pt/Cu](18) multilayer films
Yu YS, Li XZ, George TA, Fei WD, Li HB, Sellmyer DJ
Thin Solid Films, 531, 460, 2013 |
| 4 |
Characterization of a controlled electroless deposition of copper thin film on germanium and silicon surfaces
Scudiero L, Fasasi A, Griffiths PR
Applied Surface Science, 257(9), 4422, 2011 |
| 5 |
Fabrication of super-hydrophobic nano-sized copper films by electroless plating
Liu XL, Jiang ZH, Guo YW, Zhang ZH, Ren LQ
Thin Solid Films, 518(14), 3731, 2010 |
| 6 |
Study on chemical vapor deposited copper films on cyano and carboxylic self-assembled monolayer diffusion barriers
Kong Z, Wang Q, Ding LA, Wu T
Thin Solid Films, 518(17), 4852, 2010 |
| 7 |
Preparation and characterization of sputtered Cu films containing insoluble Nb
Mahalingam T, Lin CH, Wang LT, Chu JP
Materials Chemistry and Physics, 100(2-3), 490, 2006 |
| 8 |
The effect of deposition parameters and substrate surface condition on texture, morphology and stress in magnetron-sputter-deposited Cu thin films
Okolo B, Lamparter P, Welzel U, Wagner T, Mittemeijer EJ
Thin Solid Films, 474(1-2), 50, 2005 |
| 9 |
A model of abrasive-free removal of copper films using an aqueous hydrogen peroxide-glycine solution
Zhang L, Subramanian RS
Thin Solid Films, 397(1-2), 143, 2001 |
| 10 |
Filtered cathodic vacuum arc deposition of thin film copper
Lau SP, Cheng YH, Shi JR, Cao P, Tay BK, Shi X
Thin Solid Films, 398-399, 539, 2001 |
