검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Study of heat of reaction between plasma-polymer-coated silica fillers and biphenyl epoxy resin Kim NI, Kang HM, Yoon TH Journal of Adhesion Science and Technology, 18(12), 1325, 2004 |
| 2 |
EMC characterization and process study for electronics packaging Liu SL, Chen G, Yong MS Thin Solid Films, 462-63, 454, 2004 |
| 3 |
DSC analysis of epoxy molding compound with plasma polymer-coated silica fillers Roh JH, Lee JH, Kim NI, Kang HM, Yoon TH, Song KH Journal of Applied Polymer Science, 90(9), 2508, 2003 |
| 4 |
Multiplexing frequency mode study of packaging epoxy molding compounds using dynamic mechanical analysis Tsang CF, Hui HK Thermochimica Acta, 367-368, 93, 2001 |
| 5 |
Epoxy Molding Compound의 경화거동에 관한 연구 윤상영, 오명숙, 박내정 Polymer(Korea), 24(6), 837, 2000 |