| 1 |
PCB의 ENIG와 OSP 표면처리에 따른 Sn-3.5Ag 무연솔더 접합부의 Electromigration 특성 및 전단강도 평가
김성혁, 이병록, 김재명, 유세훈, 박영배
Korean Journal of Materials Research, 24(3), 166, 2014 |
| 2 |
무전해 니켈ㆍ 팔라듐 ㆍ 금도금 표면처리 공정의 도금 번짐 불량 및 개선
엄기헌, 서정욱, 원용선
Clean Technology, 19(2), 84, 2013 |
| 3 |
The characteristics and performance of electroless nickel and immersion Au plated aluminum alloy bipolar plates in polymer electrolyte membrane fuel cells
Tsai SY, Bai CY, Lin CH, Shi GN, Hou KH, Liu YM, Ger MD
Journal of Power Sources, 214, 51, 2012 |
| 4 |
The pH effect on black spots in surface finish: Electroless nickel immersion gold
Won YS, Park SS, Lee J, Kim JY, Lee SJ
Applied Surface Science, 257(1), 56, 2010 |
| 5 |
TEM observation of interfacial reaction layers formed between Pb(lead)-free Sn-3.5Ag solder and ENIG plated Cu substrate
Yoon JW, Jung SB
Materials Science Forum, 510-511, 554, 2006 |
| 6 |
Mechanical properties of electroless Ni/Au wire bonded to an Al pad with the effects of chemical activation
Lee WJ
Thin Solid Films, 408(1-2), 176, 2002 |
