검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Preparation of CuO powder for electroplating using lead frame etching wastes Lee SB, Jung RY, Kim SH Journal of Industrial and Engineering Chemistry, 64, 116, 2018 |
| 2 |
환원-산화법을 이용한 리드프레임 에칭폐액의 정제과정 설계 이승범, 전길송, 정래윤, 홍인권 Applied Chemistry for Engineering, 27(1), 21, 2016 |
| 3 |
Effect of the Ni/Pd/Au-Cu pre-plated finish lead frame surface structure treated by various surface roughening methods on packaging properties Ma R, Li MY, Fang L, Zhu SD, Zheng RS Journal of Adhesion Science and Technology, 30(4), 422, 2016 |
| 4 |
Oxidation of the copper alloy with pure copper plating Liu YC, Hu J, Hu AM, Li M, Mao DL Journal of Adhesion Science and Technology, 26(23), 2653, 2012 |
| 5 |
Electrodeposition of palladium on the copper lead frame: Electrode reaction characteristics and the effects of primary additives Lee JW, Ju JB, Kim JD Korean Journal of Chemical Engineering, 24(6), 960, 2007 |
| 6 |
Aging properties prediction of the lead frame Cu-Cr-Sn-Zn alloy via neural network Li HJ, Su JH, Dong QM, Liu P, Ren FZ Materials Science Forum, 475-479, 3331, 2005 |