| 1 |
Recommended values for the beta Sn solidus line in Sn-Bi alloys
Belyakov SA, Gourlay CM
Thermochimica Acta, 654, 65, 2017 |
| 2 |
Solder wetting behavior enhancement via laser-textured surface microcosmic topography
Chen HY, Peng JK, Fu L, Wang XC, Xie Y
Applied Surface Science, 368, 208, 2016 |
| 3 |
The effects of Cu and Al on dry sliding wear properties of eutectic Sn-9Zn lead-free solder alloy
Ozyurek D, Yavuzer B, Tuncay T
Journal of Adhesion Science and Technology, 30(15), 1662, 2016 |
| 4 |
Detection of soldering induced damages on crystalline silicon solar modules fabricated by hot-air soldering method
Lin KM, Lee YH, Huang WY, Chen GT, Kuo YW, Wang LK, Yang SY
Renewable Energy, 83, 749, 2015 |
| 5 |
Influence of current density on surface morphology and properties of pulse plated tin films from citrate electrolyte
Sharma A, Bhattacharya S, Das S, Das K
Applied Surface Science, 290, 373, 2014 |
| 6 |
Effects of hydroquinone and gelatin on the electrodeposition of Sn-Bi low temperature Pb-free solder
Goh Y, Haseeb ASMA, Sabri MFM
Electrochimica Acta, 90, 265, 2013 |
| 7 |
The measurement of thermal conductivity variation with temperature for Sn-20 wt.% In based lead-free ternary solders
Ozturk E, Aksoz S, Keslioglu K, Marasli N
Thermochimica Acta, 554, 63, 2013 |
| 8 |
Electrodeposition of eutectic Sn96.5Ag3.5 films from iodide-pyrophosphate solution
Venkatasamy V, Riemer S, Tabakovic I
Electrochimica Acta, 56(13), 4834, 2011 |
| 9 |
Enthalpies of mixing of liquid systems for lead free soldering: Al-Cu-Sn system
Flandorfer H, Rechchach M, Elmahfoudi A, Bencze L, Popovic A, Ipser H
Journal of Chemical Thermodynamics, 43(11), 1612, 2011 |
| 10 |
Influence of process parameters on SAC305 lead-free solder powder produced by centrifugal atomization
Plookphol T, Wisutmethangoon S, Gonsrang S
Powder Technology, 214(3), 506, 2011 |
