1097 - 1102 |
Effect of chromate additive on the kinetics and mechanism of skeletal copper formation Smith AJ, Ma L, Tran T, Wainwright MS |
1103 - 1108 |
Kinetics and mechanism of the formation of doped skeletal copper catalysts: the effect of zincate compared to undoped and chromate-doped systems Smith AJ, Tran T, Wainwright MS |
1109 - 1117 |
Electrochemical synthesis of Cr(II) at carbon electrodes in acidic aqueous solutions Yin Q, Brandon NP, Kelsall GH |
1119 - 1124 |
Electrochemical and thermal behaviour of LiNi0.8Co0.2O2 cathode in sealed 18650 Li-ion cells Lu W, Lee CW, Venkatachalapathy R, Prakash J |
1125 - 1132 |
Evaluation of nickel deposition by electrochemical impedance spectroscopy Holm M, O'Keefe TJ |
1133 - 1136 |
Induced effect of Mn3O4 on formation of MnO2 crystals favourable to catalysis of oxygen reduction Wei ZD, Huang WZ, Zhang ST, Tan J |
1137 - 1142 |
A novel electrocatalytic polyaniline electrode for methanol oxidation Luna AMC |
1143 - 1150 |
Preparation on iron of a polypyrrole (PPy) electrode modified with copper by the electrochemical cementation process Makhloufi L, Hammache H, Saidani B, Akilal N, Maloum Y |
1151 - 1155 |
Platinum-tin alloy electrodes for direct methanol fuel cells Rahim MAA, Khalil MW, Hassan HB |
1157 - 1161 |
Electrocatalysis of oxygen evolution at stainless steel anodes by electrosynthesized cobalt hydroxide coatings Dinamani M, Kamath PV |
1163 - 1168 |
Diffusion coefficients of Cu(II) complexes with ligands used in alkaline electroless copper plating solutions Norkus E |
1169 - 1172 |
An interpretation of the Zech-Podlaha-Landolt model of metal codeposition via queuing theory Fahidy TZ |
1173 - 1177 |
Substitutional inhibition mechanism of mild steel hydrochloric acid corrosion by hexylamine and dodecylamine Bastidas JM, Polo JL, Cano E |
1179 - 1182 |
Preparation of Li-Mn-O thin films by r.f.-sputtering method and its application to rechargeable batteries Komaba S, Kumagai N, Baba M, Miura F, Fujita N, Groult H, Devilliers D, Kaplan B |
1183 - 1186 |
Relationship between apparent electrical-conductivity and preparation conditions for nickel foam Liu PS, Chen H, Liang KM, Gu SR, Yu Q, Li TF, Fu C |