| 809 - 816 |
Cathodic Process and Cyclic Redox Reactions in Aluminum Electrolysis Cells
Sterten A, Solli PA |
| 817 - 822 |
Performance-Characteristics of a New-Type of Lead Dioxide-Coated Titanium Anode
Ueda M, Watanabe A, Kameyama T, Matsumoto Y, Sekimoto M, Shimamune T |
| 823 - 832 |
An Electrochemical Study of Reduced Ilmenite Carbon-Paste Electrodes
Marinovich Y, Bailey S, Avraamides J, Jayasekera S |
| 833 - 840 |
Kinetic Aspects of Self-Discharge of Nickel-Hydrogen Batteries and Methods for Its Prevention
Visintin A, Anani A, Srinivasan S, Appleby AJ, Lim HS |
| 841 - 845 |
Cathodic Reduction and Infrared Reflectance Spectroscopy of Basic Copper(II) Salts on Copper Substrate
Malvault JY, Lopitaux J, Delahaye D, Lenglet M |
| 846 - 851 |
Electrochemical Mediators for Total Oxidation of Chlorinated Hydrocarbons - Formation Kinetics of Ag(II), Co(III), and Ce(IV)
Bringmann J, Ebert K, Galla U, Schmieder H |
| 852 - 856 |
A Voltammetric Investigation of the Oxidation of Pyrite in Nitric-Acid Solutions - Relation to Treatment of Refractory Gold Ores
Flatt JR, Woods R |
| 857 - 863 |
Influence of Zeolite on Electrochemical and Physicochemical Properties of Polyethylene Oxide Solid-Electrolyte
Munichandraiah N, Scanlon LG, Marsh RA, Kumar B, Sircar AK |
| 864 - 868 |
Pressure-Drop Behavior in a 3-Dimensional Packed-Bed Cell During Copper Deposition and Hydrogen Evolution
Stankovic VD, Lazarevic G, Wragg AA |
| 869 - 873 |
Effect on Discharge of the Heat-Treatment of Graphite Fluoride Under a Hydrogen Atmosphere
Kumagai N, Kawamura M, Hirohata H, Tanno K, Chong Y, Watanabe N |
| 874 - 880 |
Electrode Stabilities of Copper-Containing Misch Metal-Nickel-Based Hydride Forming Alloys
Weizhong T, Yingxin G, Haoyu Z |
| 881 - 885 |
Variation of the Dielectric-Constant of Anodic Oxide-Films on Titanium with Oxygen Evolution
Rahim MA |
| 886 - 889 |
Electrochemical-Behavior of Perrhenate Ions in Molten Alkali Fluorides
Affoune AM, Bouteillon J, Poignet JC |
| 890 - 894 |
Observations of Inclusions of Polymeric Additives in Copper Electrodeposits by Transmission Electron-Microscopy
Hope GA, Brown GM, Schweinsberg DP, Shimizu K, Kobayashi K |
