1295 - 1295 |
Design is a matter for the boss Zimmermann DH |
1331 - 1334 |
Micro-injection moulding - The aims of a project partnership. Kukla C, Loibl H, Detter H |
1338 - 1340 |
Micro-injection moulding - Extending the boundaries of the feasible. Seidler D, Zelenka R |
1344 - 1345 |
Micro-injection moulding - Mould technology. Eberle H |
1349 - 1350 |
Plastics in various dimensions. Michaeli W, Rogalla A, Ziegmann C, Schulz J, Okon W |
1357 - 1362 |
Accurate dimensions the target. Steinbichler G, Giessauf J |
1371 - 1373 |
Decorating with inserts. Schutt HK |
1376 - 1379 |
In-mould decoration by injection-compression moulding for flat parts using sensitive decorative materials. Kaufmann G, Klotz B, Volckmann K |
1384 - 1387 |
Electric drives for the screw and toggle. Popp HJ |
1392 - 1392 |
Specially designed injection molding systems with high-speed motors [Anonymous] |
1394 - 1394 |
Automation in the production of smart cards [Anonymous] |
1396 - 1399 |
Clean-room production: The centerpiece of medical technology. Kudlik N |
1404 - 1404 |
Liquid silicon rubber for tubing - Gas injection techniques facilitate Brunswick A, Henze E |
1407 - 1407 |
Toggle-modular machines from the post - New concept for high-speed movement [Anonymous] |
1408 - 1409 |
Fast demoulding. Bourdon R, Kasparbauer K |
1412 - 1414 |
Horizontal mould rotation. Jaroschek C, Steger R |
1418 - 1419 |
Automatic optimization. Bader C |
1422 - 1422 |
Tool support increases output [Anonymous] |
1425 - 1428 |
Linear and articulated robots. Wenzel M |
1432 - 1432 |
Light weight with heavy advantages [Anonymous] |
1436 - 1440 |
Electric drives in extrusion. Fischer H |
1455 - 1457 |
Hoses that heal Collin H |
1460 - 1460 |
Parallel and opposing [Anonymous] |
1462 - 1463 |
More quality in composites. Berghaus U, Kramer W |
1468 - 1468 |
Economic thermoplastics [Anonymous] |
1470 - 1470 |
LFT moves ahead Liebold R |
1472 - 1474 |
PAE/PA blends. Weber M, Eichenauer U, Queisser J |
1478 - 1480 |
Galvanic metallisation of polyarylamid. Roubal J |
1482 - 1484 |
TPE sealing profiles. Beitzel M |
1488 - 1491 |
Water-blown TPV profiles. Glockler J, Kenens L |
1494 - 1496 |
Well padded. Diegritz W |
1498 - 1500 |
Material selection and calculation. Mohr-Matuschek U, Richter M |
1506 - 1509 |
Hot-embossing of electronic circuits. Stampfer S, Ehrenstein GW |