The direct integration of electronic and mechanical functions on moulded interconnect devices (MID) offers considerable potential for product design and cost reduction. The mechatronic approach inherent in MID simplifies assembly and makes it more reliable. The thermoplastic materials used for their production are flame-retardant without additives, easy to recycle, and thus also more environment-friendly. A wide variety of production processes is available for the realisation of many different MID concepts.