RADIATION-INDUCED CROSSLINKING. By post-crosslinking with an electron beam, it is possible to prevent engineering thermoplastics such as PA from softening or melting when used as circuit carriers in MID applications. A definite improvement in the stability during soldering is the result. At the same time, the adhesive strength of metallic circuit traces and/or of plastic-plastic interconnection is increased. The crosslinking of plastics provides a very effective method for modifying the properties of engineering thermoplastics, particularly with regard to the current lead problem for the production of 3D-MIDs.