Six latent curing agents were prepd. by complexing Cu(II), Ni(II) and Co(II) ions with 1-butylimidazole (1:2 or 1:4 mole ratio) in aq. soln. for 30 min. The agents were then used for curing a corn. epoxy resin in adhesive joints (Al plates) at 140 degrees C for 4 h. The complexing of 1-butylimidazole (1:2) resulted in a small increase in the shear strength of the joints and a substantial prolongation of the pot life time of the compn.