Preparation of anodic aluminum oxide (AAO) nano-template on silicon and its application to one-dimensional copper nano-pillar array formation

Lan Shen; Mubarak Ali; Zhengbin Gu; Bonggi Min; Dongwook Kim; Chinho Park

Korean Journal of Chemical Engineering, Vol.30, No.1, 221-227, January, 2013

DOI10.1007/s11814-012-0124-y Export Citation

Preparation of anodic aluminum oxide (AAO) nano-template on silicon and its application to one-dimensional copper nano-pillar array formation

Lan Shen, Mubarak Ali, Zhengbin Gu, Bonggi Min¹, Dongwook Kim, and Chinho Park^†

School of Chemical Engineering, Yeungnam University, 214-1, Dae-dong, Gyeongsan 712-749, Korea
¹Center for Research Facilities, Yeungnam University, 214-1, Dae-dong, Gyeongsan 712-749, Korea

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Anodized aluminum oxide (AAO) nanotemplates were prepared using the Al/Si substrates with an aluminum layer thickness of about 300 nm. A two-step anodization process was used to prepare an ordered porous alumina nanotemplate, and the pores of various sizes and depths were constructed electrochemically through anodic oxidation. The optimum morphological structure for large area application was constructed by adjusting the applied potential, temperature, time, and electrolyte concentration. SEM investigations showed that hexagonal-close-packed alumina nano-pore arrays were nicely constructed on Si substrate, having smooth wall morphologies and well-defined diameters. It is also reported that one dimensional copper nanopillars can be fabricated using the tunable nanopore sized AAO/Si template, by controlling the copper deposition process.

Keywords:Anodic Aluminum Oxide (AAO);Copper;Self-assembly;Nano-pore;Electrolyte

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[2] Kresge CT, Leonowicz ME, Roth WJ, Vartuli JC, Beck JS, Nature., 359, 710 (1992)

[3] Masuda H, Fukuda K, Science, 268(5216), 1466 (1995)

[4] Hwang SK, Jeong SH, Hwang HY, Lee OJ, Lee KH, Korean J. Chem. Eng., 19(3), 467 (2002)

[5] Kim TY, Jeong SH, Korean J. Chem. Eng., 25(3), 609 (2008)

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[7] Lee Y, Jung J, Korean Chem. Eng. Res., 49(1), 28 (2011)

[8] Li Y, Zheng M, Ma L, Shen W, Nanotechnology., 17, 5105 (2006)

[9] Ding Y, Kim YJ, Erlebacher J, Adv. Mater., 16(21), 1897 (2004)

[10] Switzer JA, Hung CJ, Huang LY, Scott Miller F, Zhou Y, Raub ER, Shumsky MG, Bohannan EW, J. Mater. Res., 13, 909 (1998)

[11] Faulds K, Littleford RE, Graham D, Dent G, Smith WE, Anal. Chem., 76, 592 (2004)

[12] Ono S, Saito M, Asoh H, Electrochem. Solid State Lett., 7(7), B21 (2004)

[13] Singh GK, Golovin AA, Aranson IS, Phys. Rev., B., 73, 205422 (2006)

[14] Asoh H, Nishio K, Nakao M, Yokoo A, Tamamura T, Masuda H, J. Vac. Sci. Technol. B, 19(2), 569 (2001)

[15] Sanz O, Echave FJ, Odriozola JA, Montes M, Ind. Eng. Chem. Res., 50(4), 2117 (2011)

[16] Wood GC, O’Sullivan JP, Electrochim. Acta., 15, 1865 (1970)

[17] Setoh S, Miyata A, Sci. Pap. Inst. Phys. Chem. Res., (Jpn.)., 17, 189 (1932)

[18] Ebihara K, Takahashi H, Nagayama M, J. Met. Finish. Jpn., 33, 156 (1982)

[19] Li F, Zhang L, Robert, Metzger M, Chem. Mater., 10, 2470 (1998)

[20] Schwirn K, Lee W, Hillebrand R, Steinhart M, Gosele KNU, ACS Nano., 2, 302 (2008)

[21] Patermarakis G, Karayannis HS, Electrochim. Acta, 40(16), 2647 (1995)

[22] Patermarakis G, Nicolopoulos N, J. Catal., 187(2), 311 (1999)

[23] Patermarakis G, Tzouvelekis D, Electrochim. Acta, 39(16), 2419 (1994)

[24] Johansson A, Torndahl T, Ottosson LM, Boman M, Carlsson JO, Mater. Sci. Eng., C., 23, 823 (2003)

[25] Keilbach A, Moses J, RalfKohn, Doblinger M, Bein T, Chem. Mater., 22, 5430 (2010)

[26] Inguanta R, Piazza S, Sunseri C, Appl. Surf. Sci., 255(21), 8816 (2009)