With respect to more standard and more widely used inductive-heating, the resistively-heated reactors offer the strong advantage of low cost, easy installation and low running constraints. Combined with an easy adaptation to the increasing size of wafers, this results in very strong advantages. This simple technique was mainly restricted to the growth of small size samples for academic purpose [1]. In this work we report an investigation of 2 inch SiC layers deposited in a new, horizontal and resistively-heated, "hot-wall" LP-CVD reactor specially designed for large flexibility.