CF4 플라즈마 처리에 의한 잉크젯 프린팅 Ag박막과 폴리이미드 사이의 계면파괴에너지 향상에 관한 연구

박성철; 조수환; 정현철; 정재우; 박영배; Sung-Cheol Park; Su-Hwan Cho; Hyun-Cheol Jung; Jae-Woo Joung; Young-Bae Park

Korean Journal of Materials Research, Vol.17, No.4, 215-221, April, 2007

DOI10.3740/MRSK.2007.17.4.215 Export Citation

CF4 플라즈마 처리에 의한 잉크젯 프린팅 Ag박막과 폴리이미드 사이의 계면파괴에너지 향상에 관한 연구

A Study on Improvement of Interfacial Adhesion Energy of Inkjet-printed Ag Thin film on Polyimide by CF4 Plasma Treatment

박성철, 조수환¹, 정현철¹, 정재우¹, 박영배^†

안동대학교 신소재공학부
¹삼성전기 중앙연구소

Sung-Cheol Park, Su-Hwan Cho¹, Hyun-Cheol Jung¹, Jae-Woo Joung¹, and Young-Bae Park^†

School of Material Science and Engineering, Andong National University, Andong 760-749, Korea
¹Central R&D Institute, Samsung Electro-mechanics, Suwon 443-803, Korea

E-mail:

The effect of CF4 plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from 180o peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. CF4 plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to CF4 plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in inkjet printed Ag/polyimide systems.

Keywords:Adhesion;Peel test;Inkjet-printed Ag;Polyimide;Thin film

[References]

Liu ZC, Su Y, Varahramyan K, Thin Solid Films, 478(1-2), 275 (2005)
Park YB, Park IS, Yu J, Mater. Sci. Eng. A, 266, 261 (1999)
Park YB, Yu J, Met. Mater. Int., 7(2), 123 (2001)
Song JY, Yu J, Acta Mater., 50, 3985 (2002)
Kim MH, Lee KW, Met. Mater. Int., 12(5), 425 (2006)
Kim SH, Na SW, Lee NE, Nam YW, Kim YH, Surf. Coat. Technol., 200, 2072 (2005)
Lee SB, Kim YK, Kim JS, Korean J. Mater. Res., 16(9), 543 (2006)
Kim KS, Aravas N, Int. J. Sol. Struct., 24(4), 417 (1988)
Kinloch AJ, Lau CC, Williams JG, Int. J. Frac., 66(1), 45 (1994)
Wagner CD, Riggs WM, Davis LE, Moulder JF, Handbook of X-ray Photoelectron Spectroscopy, Perkin-Elmer Corporation, Eden Prairie, MN, U. S. A.,(1978). (1978)
GREENWOOD OD, BOYD RD, HOPKINS J, BADYAL JPS, J. Adhes. Sci. Technol., 9(3), 311 (1995)
Gerenser LJ, J. Vac. Sci. Technol. A, 6(5), 2897 (1988)
Park SC, Cho SW, Jung HC, Joung JW, Park YB, Proceeding of the 2006 fall technical symposium on microelectronics and packaging, 29 (2006). (2006)
Rubira AF, Rancourt JD, Caplan ML, Anne K. St. Clair, Taylor LT, Chem. Mater., 6, 2351 (1994)
Hu D, Chen H, J. Mater. Sci., 27, 5262 (1992)
Kim YH, Master Thesis., Seoul National University, (2006). (2006)

[Referenced By]

[1] Liu ZC, Su Y, Varahramyan K, Thin Solid Films, 478(1-2), 275 (2005)

[2] Park YB, Park IS, Yu J, Mater. Sci. Eng. A, 266, 261 (1999)

[3] Park YB, Yu J, Met. Mater. Int., 7(2), 123 (2001)

[4] Song JY, Yu J, Acta Mater., 50, 3985 (2002)

[5] Kim MH, Lee KW, Met. Mater. Int., 12(5), 425 (2006)

[6] Kim SH, Na SW, Lee NE, Nam YW, Kim YH, Surf. Coat. Technol., 200, 2072 (2005)

[7] Lee SB, Kim YK, Kim JS, Korean J. Mater. Res., 16(9), 543 (2006)

[8] Kim KS, Aravas N, Int. J. Sol. Struct., 24(4), 417 (1988)

[9] Kinloch AJ, Lau CC, Williams JG, Int. J. Frac., 66(1), 45 (1994)

[10] Wagner CD, Riggs WM, Davis LE, Moulder JF, Handbook of X-ray Photoelectron Spectroscopy, Perkin-Elmer Corporation, Eden Prairie, MN, U. S. A.,(1978). (1978)

[11] GREENWOOD OD, BOYD RD, HOPKINS J, BADYAL JPS, J. Adhes. Sci. Technol., 9(3), 311 (1995)

[12] Gerenser LJ, J. Vac. Sci. Technol. A, 6(5), 2897 (1988)

[13] Park SC, Cho SW, Jung HC, Joung JW, Park YB, Proceeding of the 2006 fall technical symposium on microelectronics and packaging, 29 (2006). (2006)

[14] Rubira AF, Rancourt JD, Caplan ML, Anne K. St. Clair, Taylor LT, Chem. Mater., 6, 2351 (1994)

[15] Hu D, Chen H, J. Mater. Sci., 27, 5262 (1992)

[16] Kim YH, Master Thesis., Seoul National University, (2006). (2006)