Journal of Industrial and Engineering Chemistry, Vol.24, 140-147, April, 2015
Electrodeposition of Cu2O particles on reinforced concrete substrate
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Cu2O as an antimicrobial agent was electrodeposited on reinforced concrete with the aim to control microbial corrosion in concrete sewers. Alkalize Cu(II) lactate were used as electrolyte and the concentration of copper sulfate was decreased from 0.6 M to 0.1 M and for lactic acid from 3 M to 0.75 M. The results showed the formation of Cu2O particles on concrete substrate. The investigation of electrodeposition time on the purity of Cu2O was revealed that increasing in the time of electrodeposition and depletion of OH? ions close to the substrate caused to co-deposit of Cu or CuO with Cu2O.
- Vaidya S, Allouche EN, Constr. Build. Mater., 24(11), 2164 (2010)
- Haile T, Nakhla G, Allouche EN, Vaidya S, Corrosion Sci., 52, 45 (2010)
- Satoh H, Odagiri M, Ito T, Okabe S, Water Res., 43(18), 4729 (2009)
- Jensen HS, Lens PNL, Nielsen JL, Bester K, Nielsen AH, Hvitved-Jacobsen T, Vollertsen J, J. Hazard. Mater., 189(3), 685 (2011)
- Valix M, Zamri D, Mineyama H, Cheung WH, Shi J, Bustamante H, Chin. J. Chem. Eng., 20(3), 433 (2012)
- Girardi F, Maggio R, Cem. Concr. Compos., 33, 276 (2011)
- Zhang L, Schryver PD, Gusseme BD, Muynck WD, Boon N, Verstraet W, Water Res., 42(1-2), 1 (2008)
- Girardi F, Vaona W, Maggio RD, Cem. Concr. Compos., 32, 595 (2010)
- Pikaar I, Rozendal RA, Yuan Z, Keller J, Rabaey K, Water Res., 45(17), 5381 (2011)
- Muynck WD, Belie ND, Verstraete W, Cem. Concr. Compos., 31(3), 163 (2009)
- Pikaar I, Rozenda RA, Yuan Z, Keller J, Rabaey K, Water Res., 45(6), 2281 (2011)
- Sydney R, Esfandi E, Water Environ. Res., 68(3), 338 (1996)
- Hewayde E, Nakhla GF, Allouche EN, Mohan P, Struct. Infrastruct. Eng., 3(3), 67 (2007)
- Haile T, Nakhla GF, Allouche EN, Corrosion Sci., 50(3), 713 (2008)
- Vaidya S, Montes C, Allouche EN, ASCE Conf. Proc., 252, 100 (2007)
- Sunada K, Minoshima M, Hashimito K, J. Hazard. Mater., 235-236, 265 (2012)
- Ren G, Hu D, Cheng E, Vargas-Reus MA, Reip P, Allaker RP, Int. J. Antimicrob. Agents, 33(6), 587 (2009)
- Jongh PE, Vanmaekelbergh D, Kelly JJ, Chem. Mater., 11(12), 3512 (1999)
- Du QT, Tan JS, Wang QT, Li CY, Liu XH, Cai RS, Ding YH, Wang YQ, J. Anal. Methods. Chem., 8 (2012)
- Bao M, Wang D, Liu SY, Kuang LL, Sun J, Wang F, Wen YX, Appl. Surf. Sci., 258(20), 8008 (2012)
- Joseph S, Kamath PV, Solid. State. Sci., 10(9), 1215 (2008)
- Bijani S, Schrebler R, Dalchiele EA, Gabas M, Martinez L, Ramos-Barrado JR, J. Phys. Chem. C, 115(43), 21373 (2011)
- Lee JH, Hong SK, Ko WB, J. Ind. Eng. Chem., 16(4), 564 (2010)
- Srivastava A, Balasubramaniam R, Bull. Mater. Sci., 26(6), 593 (2003)
- Sun W, Sun WE, Zhuo Y, Chu Y, Solid. State. Chem., 184(7), 1638 (2011)
- Shang Y, Zhang D, Guo L, J. Mater. Chem., 22, 856 (2012)
- Bakhtiari F, Darezereshki E, Mater. Lett., 65, 171 (2011)
- Darezereshki E, Bakhtiari F, J. Min. Metall., 49(1), 21 (2013)
- Mirghiasi Z, Bakhtiari F, Darezereshki E, Esmaeilzadeh E, J. Ind. Eng. Chem., 20(1), 113 (2014)