Przemysl Chemiczny, Vol.94, No.10, 1683-1686, 2015
Use of propionic acid in plasma modification of a polyamide-polyethylene film
A com. polyamide-polyethylene film was plasma-pretreated in Ar, optionally covered with a SiO2 layer, plasma-coated with EtCOOH at 25-60 degrees C under atm. pressure and then studied for contact angle, steam permeability, surface topog., layer thickness and antibacterial activity. The films corered with SiO2 and then with EtCOOH at 60 degrees C showed the highest antibacterial activity (59%). The films may be used as active food packaging.