Cu/Cr/Polyimide 계의 탄-소성 필 테스트에 대한 해석

박영배; 유진; Young-Bae Park; Jin Yu

Korean Journal of Materials Research, Vol.9, No.3, 301-306, March, 1999

Export Citation

Cu/Cr/Polyimide 계의 탄-소성 필 테스트에 대한 해석

Analysis on the Elasto- Plastic Peel Test in a Cu/Cr/Polyimide System

박영배, 유진^†

한국과학기술원 재료공학과

Young-Bae Park, and Jin Yu^{1, †}

Dept. of Materials Scoemce and Engineering, Korea Advanced Institute of Science and Technology, Taejon, 305-701, Korea
¹Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Taejon, 305-701, Korea

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초록

Cu/Cr /polyimide 계에서 금속박막 두께와 폴리이미드 표면의 플라즈마 전처리 조건에 따른 필 테스트 결과로부터 Park과 Yu 1) 의 x- 선 측정에 의한 방법과 Moidu 등 2, 3) 의 이론적 방법을 통해 Cr/polyimide 계면균열의 계면파괴에너지를 구했다. 두 방법으로 구한 박막의 소성일과 계면파괴에너지는 대부분의 경우에 대해 서로 잘 일치하였으며, 이와 갈은 실험적 방법과 이론적 방법 모두 계면파괴에너지의 측정에 유용함을 알 수 있었다. 계면파괴에너지는 박막 두께에 거의 무관하였으며, 0.03, 0.036 그리고 0.05 W/cm2 의 rf 플라즈마 밀도에 대해 각각 46.8 ± 17.8, 170.3 ± 42.9 그리고 253.9 ± 44.4 J/m2의 계면파괴에너지를 얻었다.

The interfacial fracture energies, Γ, of the Cu/Cr/polyimide system were deduæd under varying Cu film thickness and pretreatment conditions based on two methods; X-ray measurement by Park and Yu1) and theoretical methods by Moidu et al. 2, 3) The two methods showed reasonable agreement for most cases, imparting validity for both approaches. Estimated r were quite independent of the metal film thickness and increased with the rf plasma power density of polyimide pretreatment as expected. Estimated values of r were 46.8 ± 17.8, 170.3 ± 42.9 and 253.9 ± 44.4 J/m2 for the rf plasma power density of 0.03, 0.036 and 0.05 W /cm2, respectively.

[References]

Park IS, Yu J, Acta Mater., 46, 2947 (1998)
Moidu AK, Sinclair AN, Spelt JK, J. Testing Eval., 23, 241 (1995)
Moidu AK, Sinclair AN, Spelt JK, J. Testing Eval., 26, 247 (1998)
Kim KS, Aravas N, Int. J. Solids Struct., 24, 417 (1988)
Kinloch AJ, Lau CC, Williams JG, Int. J. Fract., 66, 45 (1994)
Bagchi A, Evans AG, Interfac Science, 3, 169 (1996)
Kim KS, Kim J, Trans. ASME, J. Eng. Mater. Tech., 110, 266 (1988)
Aravas N, Kim KS, Loukis MJ, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 107, 159 (1989)
Spies GJ, J. Aircraft Eng., 25, 64 (1953)
Bickerman JJ, J. Appl. Phys., 28, 1484 (1957)
Kendall K, J. Adhes., 5, 105 (1973)
Gent AN, Hamed GR, J. Adhes., 7, 91 (1975)
Kanninen MF, Int. J. Fract., 9, 83 (1973)
Penado FE, J. Composite Mat., 27, 383 (1993)
Fernlund G, Spelt JK, J. Composites Tech. Res., 16, 234 (1994)
Park YB, Ph.D. Thesis, KAIST (1999)
Chou NJ, Tang CH, J. Vac. Sci. Technol. A, 2, 751 (1984)
Ahn EC, Yu J, Park IS, J. Mater. Sci., 7, 175 (1996)

[1] Park IS, Yu J, Acta Mater., 46, 2947 (1998)

[2] Moidu AK, Sinclair AN, Spelt JK, J. Testing Eval., 23, 241 (1995)

[3] Moidu AK, Sinclair AN, Spelt JK, J. Testing Eval., 26, 247 (1998)

[4] Kim KS, Aravas N, Int. J. Solids Struct., 24, 417 (1988)

[5] Kinloch AJ, Lau CC, Williams JG, Int. J. Fract., 66, 45 (1994)

[6] Bagchi A, Evans AG, Interfac Science, 3, 169 (1996)

[7] Kim KS, Kim J, Trans. ASME, J. Eng. Mater. Tech., 110, 266 (1988)

[8] Aravas N, Kim KS, Loukis MJ, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 107, 159 (1989)

[9] Spies GJ, J. Aircraft Eng., 25, 64 (1953)

[10] Bickerman JJ, J. Appl. Phys., 28, 1484 (1957)

[11] Kendall K, J. Adhes., 5, 105 (1973)

[12] Gent AN, Hamed GR, J. Adhes., 7, 91 (1975)

[13] Kanninen MF, Int. J. Fract., 9, 83 (1973)

[14] Penado FE, J. Composite Mat., 27, 383 (1993)

[15] Fernlund G, Spelt JK, J. Composites Tech. Res., 16, 234 (1994)

[16] Park YB, Ph.D. Thesis, KAIST (1999)

[17] Chou NJ, Tang CH, J. Vac. Sci. Technol. A, 2, 751 (1984)

[18] Ahn EC, Yu J, Park IS, J. Mater. Sci., 7, 175 (1996)