Biphenyl계 에폭시 Phenol Novolac 수지 조성물의 화학레올로지 연구

김현용; 문경식; 한승; 김진모; 유제홍; 윤호규

Polymer(Korea), Vol.23, No.1, 105-112, January, 1999

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Biphenyl계 에폭시 Phenol Novolac 수지 조성물의 화학레올로지 연구

Chemorheological Study of Biphenyl-Type Epoxy/Phenol Novolac Resin System

김현용, 문경식, 한승, 김진모, 유제홍, 윤호규

초록

등온경화조건에서 biphenyl계 에폭시/phenol novolac 수지 조성물의 호학레올로지 연구를 수행하였다. 등온경화반응에 따른 점도의 변화를 예측하기 위해 modified Wiliams-L뭉디-Ferry (WLF)식을 이용하였다. DSC 측정으로부터 경화반응에 따른 유리전이온도의 변화를 전환량의 함수로 표현할 수 있었다. 등온경화반응에 따라 측정된 점도의 변화를 이용하여 WLF식에서의 C₁, C₂₁, C_{2
A chemorheological study of biphenyl-type epoxy/phenol novolac system was performed at different isothermal curing temperatures. To predict the chemoviscosity during isothermal curing reaction. modified Willians-Landel-Ferry (WLF) equation was used. Glass transition temperature change due to curing reaction measured by DSC could be expressed as a function of conversion. From the measurements of isothermal viscosity, C₁ and C₂ in WLF equation were found to have an Arrhenius-type dependence on temperature. By using these relations in conjunction with modified WLF equation, good agreement between predicted and experimental viscosity was observed.

Keywords:chemorheology;biphenyl-type epoxy/phenol novolac system;modified Williams-Landel-Ferry (WLF) equation;glass transition temperature

[References]

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Tajima YA, Crozier D, Polym. Eng. Sci., 23, 186 (1983)

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[Referenced By]}

[1] Yoon HG, Moon KS, Kim JM, Polym. Abstracts, 22(1), 2L5-1 (1997)

[2] Han S, Kim WG, Yoon HG, Moon TJ, J. Polym. Sci. A: Polym. Chem., 36(5), 773 (1998)

[3] Han S, Kim WG, Yoon HG, Moon TJ, J. Appl. Polym. Sci., 68(7), 1125 (1998)

[4] Han S, Kim WG, Yoon HG, Moon TJ, Bull. Korean Chem. Soc., 18, 11 (1997)

[5] Han S, Kim WG, Suh KS, Yoon HG, Moon TJ, J. Polym. Sci. A: Polym. Chem., in press

[6] Han S, Kim WG, Hwang SD, Yoon HG, Suh KS, Moon TJ, Polym.(Korea), 22(5), 691 (1998)

[7] Halley PJ, Mackay ME, Polym. Eng. Sci., 36(5), 593 (1996)

[8] Hou TH, Huang JYZ, Hinkley JA, J. Appl. Polym. Sci., 41, 819 (1990)

[9] Stockmayer WH, J. Polym. Sci., 6, 96 (1952)

[10] Lipshitz SD, Macosko CW, Polym. Eng. Sci., 16, 803 (1976)

[11] Mijovic J, Lee CH, J. Appl. Polym. Sci., 37, 889 (1989)

[12] Tajima YA, Crozier D, Polym. Eng. Sci., 23, 186 (1983)

[13] Yang YS, Suspene L, Polym. Eng. Sci., 31, 321 (1991)

[14] Williams ML, Landel RF, Ferry JD, J. Am. Chem. Soc., 77, 3701 (1955)

[15] Tung CYM, Dynes PJ, J. Appl. Polym. Sci., 27, 569 (1982)

[16] Winter HH, Polym. Eng. Sci., 27, 1698 (1987)

[17] Kamal MR, Polym. Eng. Sci., 14, 23 (1974)

[18] Horie K, Hiura H, Sawada M, Mita I, Kambe H, J. Polym. Sci. A: Polym. Chem., 8, 1359 (1970)

[19] Gillham JK, Polym. Eng. Sci., 19, 676 (1979)

[20] Matsuoka S, Quan X, Bair HE, Boyle DJ, Macromolecules, 22, 4093 (1989)

[21] Flory PJ, "Principles of Polymer Chemistry," Chapter 9, Cornell University Press, Ithaca, N.Y. (1953)

[22] Hale A, "Epoxy Used in the Encapsulation of Integrated Circuit: Chemistry, Rheology, Glass Transition, and Reactive Processing," Ph.D. Thesis, University of Minnesota (1988)

[23] Simon SL, Gillham JK, J. Appl. Polym. Sci., 46, 1245 (1992)

[24] Venditti RA, Gillham JK, J. Appl. Polym. Sci., 64(1), 3 (1997)

[25] Hale A, Macosko CW, Bair HE, Macromolecules, 24, 2610 (1989)

[26] Miller DR, Macosko CW, Macromolecules, 9, 206 (1976)