- Previous Article
- Next Article
- Table of Contents
Journal of Industrial and Engineering Chemistry, Vol.75, 296-303, July, 2019
Polybenzoxazole/graphene nanocomposite for etching hardmask
E-mail:,
We demonstrate that graphene can enhance the etch resistance of polymeric hardmask significantly. Graphene oxide with a sub-micrometer diameter (nGO) was functionalized with
fluorinated poly (hydroxyamide) (FPHA) via a chemical coupling reaction. The FPHA-functionalized-nGO can be dispersed in various organic solvents including methanol, cyclohexanone, dimethylformamide, and N-methyl pyrrolidone. In addition, the dispersions were spincoated to prepare hardmask films which were then thermally annealed to produce nRGO-fluorinated-polybenzoxazole (FPBO) film. Compared to pristine FPBO film, elastic modulus (122%), hardness (92%), and etch resistance (54%) were significantly enhanced at 17 wt.% graphene loading, surpassing the properties of commercial CHM009 film.
- Wu W, Chang EY, Cheon H, Kim SK, Cho HM, et al., Proc. SPIE, 7140, 71402Q (2008)
- Sakai I, Abe J, Hayashi H, Taniguchi Y, Kato H, et al., Jpn. J. Appl. Phys., 46, 4286 (2007)
- Kofuji N, Negishi N, Ishimura H, Nishida T, Jpn. J. Appl. Phys., 53, 03DE01 (2014)
- Zanchetta E, Della Giustina G, Grenci G, Pozzato A, Tormen M, Brusatin G, Adv. Mater., 25(43), 6261 (2013)
- Oh C, Uh DS, Kim DH, Lee JK, Yun HC, et al., Proc. SPIE, 6519, 65192R (2007)
- Oh C, Lee JK, Kim MS, Yoon KH, Cheon HS, et al., Proc. SPIE, 6923, 69232V (2008)
- Cheon GS, Yoon KH, Kim MS, Oh SB, Song JY, et al., Proc. SPIE, 7140, 71402R (2008)
- Cheon HS, Yoon KH, Kim MS, Oh SB, Song JY, et al., Proc. SPIE, 7273, 727310 (2009)
- Gokan H, Esho S, Ohnish Y, J. Electrochem. Soc., 130, 143 (1983)
- Kudo T, Rahman MD, McKenzie D, Anyadiegwu C, Doerrenbaecher S, et al., Proc. SPIE, 9051, 90511X (2014)
- Haghi AK, Thomas S, Praveen KM, Pai AR, Apple Academic Press, Florida, 2018.
- Haghi AK, Aguilar CN, Thomas S, Praveen KM, Physical Chemistry for Engineering and Applied Sciences, Apple Academic Press, Florida, 2018.
- Lu X, Huang H, Nemchuk N, Ruoff RS, Appl. Phys. Lett., 75, 193 (1999)
- Sakai I, Abe J, Hayashi H, Taniguchi Y, Kato H, et al., J. Appl. Phys., 46, 4286 (2007)
- Glodde M, Engelmann S, Guillorn M, Kanakasabapathy S, Mclellan E, et al., Proc. SPIE, 7972, 797216 (2011)
- Wakamatsu G, Goto K, Hishiro Y, Furukawa T, Murakami S, et al., Proc. SPIE, 8325, 83250T (2012)
- Chang JH, Park KM, Lee SM, Oh JB, J. Polym. Sci. B: Polym. Phys., 38(19), 2537 (2000)
- Frommhold A, Manyam J, Palmer RE, Robinson APG, Microelectron. Eng., 98, 552 (2012)
- Kim DW, Choi J, Kim D, Jung HT, J. Mater. Chem. A, 4, 17773 (2016)
- Kim D, Kim DW, Lim HK, Jeon J, Kim H, et al., Phys. Chem. Chem. Phys., 16, 22717 (2014)
- Kubota T, Nakanishi R, J. Polym. Sci. B: Polym. Phys., 2, 655 (1964)
- Kim SJ, Kim DW, Jung HT, RSC Adv., 3, 22909 (2013)
- Joen HJ, Kim KH, Baek Y, Kim DW, Jung HT, Nano Lett., 10, 3604 (2010)
- Chen D, Feng HB, Li JH, Chem. Rev., 112(11), 6027 (2012)
- Lee C, Wei X, Kysar JW, Hone J, Science, 321, 385 (2008)
- Mittal G, Dhand V, Rhee KY, Park SJ, Lee WR, J. Ind. Eng. Chem., 21, 11 (2015)
- Pei S, Cheng H, Carbon, 50, 3210 (2012)
- Mallamace F, Corsaro C, Mallamace D, Vasi S, Vasi C, Dugo G, Comput. Struct. Biotechnol. J., 13, 33 (2015)
- Nam YT, Choi J, Kang KM, Kim DW, Jung HT, ACS Appl. Mater. Interfaces, 8, 27376 (2016)
- Hung W, Tsou C, Guzman M, An Q, Liu Y, et al., Chem. Mater., 26, 2983 (2014)
- Kim H, Kim DW, Vasagar V, Ha H, Nazarenko S, Ellison CJ, Adv. Funct. Mater., 28, 180317 (2018)
- Chen Y, Zhuang Q, Liu X, Liu J, Lin S, Han Z, Nanotechnology, 24, 245702 (2013)
- Liu WW, Chai SP, Mohamedc AR, Hashim U, J. Ind. Eng. Chem., 20(4), 1171 (2014)
- Baibarac M, Lapkowski M, Pron A, Lefrant S, Baltog I, J. Raman Spectrosc., 29, 825 (1998)
- Lim J, Kim MC, Goh M, Yeo H, Shin DG, Ku BC, You NH, Carbon Lett., 14, 251 (2013)
- Li Z, Young RJ, Wang RG, Yang F, Hao LF, Jiao WC, Liu WB, Polymer, 54(21), 5821 (2013)
- Bortz DR, Heras EG, Martin-Gullon I, Macromolecules, 45(1), 238 (2012)
- Lim J, Yeo H, Goh M, Ku BC, Kim SG, et al., Chem. Mater., 27, 2040 (2015)
- Seino Y, Kobayashi K, Sho K, Kato H, Miyoshi S, et al., Proc. SPIE 6923, 6923O-6923O-8 (2008).