화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Macromolecular Research, Vol.27, No.12, 1248-1254, December, 2019
DOI10.1007/s13233-019-7170-9  Export Citation
All-Benzocyclobutene Functionalized Polycarbosilane and Derived Copolymers with Low Dielectric Constant and High Thermal Stability
Nan Zhong1, 2, Xian Li1, 2, Huan Hu1, 2, Yawen Huang2, Xu Ye1, †, and Junxiao Yang2, †
  • 1School of Materials Science and Engineering, Southwest University of Science and Technology, Mianyang 621010, P. R. China
  • 2State Key Laboratory of Environmental-Friendly Energy Materials, Southwest University of Science and Technology, Mianyang 621010, P. R. China
E-mail:,
All-benzocyclobutene functionalized polycarbosilanes and the derived copolymers were successfully synthesized by ring-opening polymerization (ROP) of 1,1-dibenzocyclobutene-1-silacyclobutane (DBCBSCB) and 1,1-diphenylsiletane (DPSCB) using Karstedt’s catalyst. Adjusting the copolymerization ratio of DBCBSCB and DPSCB could afford to control the ultimate properties of the cured resins. The linear polycarbosilanes containing dibenzocyclobutene were directly cross-linked upon high temperature. With increasing the copolymerization ratio of DBCBSCB and DPSCB, the 5% weight loss temperature (T5%) of cured resins is increased from 450 °C to 506 °C under a nitrogen atmosphere, while the dielectric constant (k) is decreased from 2.60 to 2.42 at 10 MHz. The excellent thermostability and low-dielectric performance make such thermosets have potential application in the microelectronic industry.
Keywords:dielectric constant;cross-linking;dibenzocyclobutene;thermal stability
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