A mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time-dependent predictions on the various quantities in the system. The model takes into account mass transport by diffusion and migration, Butler-Volmer kinetics at the electrode surface, and mixed potential theory. A finite difference approach is used to solve the equations, and the resultant model is used to predict the concentration profiles, potential response, and plating rate as a function of time and concentration of various reactive components.