Fabrication and optical dispersions of three-dimensional hierarchical plasmonic nanostructures

Woo Ri Ko; Manpreet Boora; Tru Nguyen Dang; Jae Kyeom Kim; Jinlin Zhang; Junghyo Nah; Zhiyong Fan; Jae Yong Suh; Min Hyung Lee

Journal of Industrial and Engineering Chemistry, Vol.107, 93-99, March, 2022

DOI10.1016/j.jiec.2021.11.034 Export Citation

Fabrication and optical dispersions of three-dimensional hierarchical plasmonic nanostructures

Woo Ri Ko, Manpreet Boora¹, Tru Nguyen Dang, Jae Kyeom Kim, Jinlin Zhang¹, Junghyo Nah², Zhiyong Fan³, Jae Yong Suh^{1, †}, and Min Hyung Lee^†

Department of Applied Chemistry, Kyung Hee University, Yongin, Gyeonggi 17104, South Korea
¹Department of Physics, Michigan Technological University, Houghton, Michigan 49931, USA
²Department of Electrical Engineering, Chungnam National University, Daejeon 34134, South Korea
³Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong Special Administrative Region

E-mail:,

This paper describes a facile method for the design and fabrication of hierarchical nanopatterns via aluminum anodization with an application for creating plasmonic crystals. Fabrication of highly-ordered anodized aluminum oxide nanopores requires an applied electric potential for anodization, which is typically set to match the pitch of nanoindentations on Al. This study reports a new voltage regime for Al anodization conditions where the process yields satellite pores of various shapes, periodicities, and sizes around the main pores. These new nanopatterned platforms provide an easy route to fabricate hierarchical metal nanostructures whose energy dispersions are shaped by the mode superposition of the surface plasmon polaritons originating from multiple periodic lattices.

Keywords:Anodized aluminum oxide;Hierarchical nanopore;Nanopattern;Nanostructures;Plasmonics;Surface plasmon polariton

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[1] Hoar TP, Mott NF, J. Phys. Chem. Solids, 9, 97 (1959)

[2] Oh J, Thompson CV, Electrochim. Acta, 56, 4044 (2011)

[3] Nielsch K, Choi J, Schwirn K, Wehrspohn RB, Gosele U, Nano Lett., 2, 677 (2002)

[4] Li AP, Muller F, Birner A, Nielsch K, Gosele U, J. Vac. Sci. Technol., 17, 1428 (1999)

[5] Masuda H, Yada K, Osaka A, Jpn. J. Appl. Phys., 37, L1340 (1998)

[6] Ono S, Saito M, Ishiguro M, Asoh H, J. Electrochem. Soc., 151, B473 (2004)

[7] Lee S, Kim D, Gillette E, Oh J, Han SW, Lee SB, Phys. Chem. Chem. Phys., 15, 10659 (2013)

[8] Masuda H, Asoh H, Watanabe M, Nishio K, Nakao M, Tamamura T, Adv. Mater., 13, 189 (2001)

[9] Shingubara S, Maruo S, Yamashita T, Nakao M, Shimizu T, Microelectron. Eng., 87, 1451 (2010)

[10] Ho AYY, Gao H, Lam YC, Rodriguez I, Adv. Funct. Mater., 18, 2057 (2008)

[11] Wang X, Xu S, Cong M, Li H, Gu Y, Xu W, Small, 8, 972 (2012)

[12] Skeldon P, Thompson GE, Garcia-Vergara SJ, Iglesias-Rubianes L, Blanco-Pinzon CE, Electrochem. Solid State Lett., 9, B47 (2006)

[13] Su Z, Hahner G, Zhou W, J. Mater. Chem., 18, 5787 (2008)

[14] Thompson GE, Thin Solid Films, 297, 192 (1997)

[15] Keller F, Hunter MS, Robinson DL, J. Electrochem. Soc., 100, 411 (1953)

[16] Jones MR, Osberg KD, Macfarlane RJ, Langille MR, Mirkin CA, Chem. Rev., 111, 3736 (2011)

[17] Shan D, Huang L, Li X, Zhang W, Wang J, Cheng L, Feng X, Liu Y, Zhu J, Zhang Y, J. Phys. Chem. C, 118, 23930 (2014)

[18] Jessensky O, Muller F, G?sele U, Appl. Phys. Lett., 72, 1173 (1998)

[19] Choi J, Wehrspohn RB, G?sele U, Electrochim. Acta, 50, 2591 (2005)

[20] Sarrazin M, Vigneron JP, Vigoureux JM, Phys. Rev. B, 67 (2003)

[21] Barnes WL, Murray WA, Dintinger J, Devaux E, Ebbesen TW, Phys. Rev. Lett., 92 (2004)