AI(Cu) thin films on the subsequent deposition of copper seed layers from copper bearing organic solutions have been completed. The amount of Cu in the AI(Cu) films was varied from 0 to 2 wt % and it was determined that a slight improvement in organically deposited copper particle density occurred with increasing Cu concentration in the Al(Cu) him. A more significant influence on organic solution copper deposition was the segregation of Cu in the Al(Cu) toward the surface of the film during annealing. Annealed Al(Cu) films were found by x-ray photoelectron spectroscopy to have a measurable increase in the concentration of Cu near the surface which facilitated the nucleation of organically deposited copper. Broad face and cross sectional transmission electron microscopy of Al(Cu) films with and without organically deposited copper seed layers indicated that the cementation exchange reaction was confined to the near surface of the Al(Cu) films and that discrete, pure copper particles were deposited from the organic solution.