Ni-Ti-Cu shape memory films were mixed-sputter deposited from separate nickel, titanium, and copper targets, providing increased compositional flexibility. Shape memory characteristics, examined for films with 7 at.% Cu and 41-51 at.% Ti, were determined with temperature-controlled substrate-curvature measurements, and the microstructure was studied with transmission electron microscopy. The Ni-Ti-Cu films were found to have shape memory properties comparable with bulk materials, with transformation temperatures between 20 and 62 degrees C, a 10-13 degrees C hysteresis, and up to 330 MPa recoverable stress.