Ion beam depth profiling and Auger electron spectroscopy (AES) have been used to characterize sputtered metal films on graphite epoxy composite substrates, with emphasis on elemental analysis of the interface between film and substrate. The AES data are correlated with adhesion strength values, obtained by the stud pull method. Films studied include chromium, nickel, titanium, tantalum, platinum, and vanadium, deposited by RF planar diode sputtering in thicknesses from 0.5 micrometers to 1.5 micrometers on substrates of graphite epoxy composite (Fiberite 934). The AES/ion beam etch profiling technique was used to determine the atomic concentration of oxygen, carbon, and the deposited metal, from the outer surface through the depth of the film, into the substrate. Atomic concentration profiles are presented for each metal and correlated with adhesion strengths, substrate preparation, and sputtering conditions. High adhesion strengths for Cr and Ti films are associated with elevated oxygen concentrations in the films, while the strong adherence of Ni to graphite-epoxy is associated with very low oxygen content. Lack of adhesion of Pt and Ta to graphite-epoxy is also associated with relatively low oxygen content in the metal/graphite-epoxy interface.