Molding-based thin film patterning techniques for polycrystalline SiC using molds made of SiO2 and polysilicon are presented. The molds are fabricated using conventional SiO2 and polysilicon deposition and patterning techniques, and are filled with polycrystalline SiC deposited by APCVD. Mechanical polishing is used to expose the molds and planarize the substrate, and wet chemical etchants are used to dissolve the molds. The molding process circumvents the selectivity problems associated with SiC reactive ion etching, and therefore is well-suited for SiC surface micromachining. Examples of surface micromachined devices patterned using micromolding are presented.