Magnetron sputtering has become one of the most important methods for depositing thin films, combined with an accurate control of process parameters and layer quality. However, this coating technique suffers from some shortcomings (e.g. low target utilization, limited sputter yield and plasma instabilities in reactive sputter processes) making it often sub-optimal for industrial purposes. In this paper, a new and advanced planar magnetron sputter source dealing with most of these problems is presented. First, the target utilization can easily be doubled by moving the magnet configuration in a well-designed and optimal way below the target. Second, the ability to apply higher power densities together with higher efficiencies results in an important increase in sputter yield. As a consequence, longer sputter runs without the need of target exchange can be achieved, together with higher machine throughput. Furthermore, this new magnetron, called Supermag(TM), is ready to implement new technologies (e.g. pulsed or AC power mode and balanced or unbalanced magnet configurations) with superior behavior and properties in both metallic and reactive sputter processes.