Previous Article Next Article Table of Contents Journal of Materials Science Letters, Vol.20, No.4, 301-302, 2001 DOI10.1023/A:1006752811945 Export Citation Interface structure and formation mechanism of diffusion-bonded SiC/Ni-Cr joint Feng JC, Liu HJ, Naka M, Schuster JC Please enable JavaScript to view the comments powered by Disqus.
