변성 폴리에테르이미드의 합성과 이를 이용한 에폭시 수지의 강인화

이신득; 안변현; 이광기; 김원호; Sin Duk Lee; Byung Hyun Ahn; Kwang Gi Lee; Won Ho Kim

Polymer(Korea), Vol.29, No.3, 231-236, May, 2005

Export Citation

변성 폴리에테르이미드의 합성과 이를 이용한 에폭시 수지의 강인화

Synthesis of Modified Polyetherimide and Toughening of Epoxy Resin

이신득, 안변현^†, 이광기¹, 김원호 ¹

부경대학교 재료공학부
¹부산대학교 화학공학부

Sin Duk Lee, Byung Hyun Ahn^†, Kwang Gi Lee¹, and Won Ho Kim¹

Division of Material Engineering, Pukyong National University, San 100 Yongdang-dong, Nam-gu, Busan 608-739, Korea
¹Division of Chemical Engineering, Pusan National University, 30 Jangjeon-dong, Geumjeong-gu, Busan 609-735, Korea

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초록

사슬 말단에 아민기를 갖는 폴리에테르이미드(AT-PEI)를 2,2'-bis[4-(3,4-dicarboxyphenoxy)-phenyl]propane dianhydride(BPADA)와 m-phenylenediamine의 반응에 의해 합성하였으며, BPADA와 m-phenylenediamine 및 3,5-diaminobenzoic acid의 반응에 의해 pendant 카복시기를 갖는 폴리에테르이미드(CP-PEI)를 합성하였다. 합성된 변성 PEI 들을 bisphenol-A의 diglycidyl ether에 첨가한 후 nadic methyl anhydride(NMA)로 경화시켜 에폭시 수지를 제조하고 열적 특성, 강인성 및 내용매성을 측정하였다. AT-PEI가 20 phr 첨가된 에폭시 수지는 내열의 저하 없이 파괴인성(KIC)가 2.88 MPaㆍm0.5로서 높은 강인성을 보였다. CP-PEI가 20 phr 첨가된 에폭시 수지의 KIC는 2.82 MPaㆍm0.5 이었다.

Amine terminated polyetherimide (AT-PEI) has been synthesized using 2,2'-bis[4-(3,4-dicarboxyphenoxy)-phenyl]propane dianhydride (BPADA) and m-phenylenediamine. Polyetherimide containing pendant carboxy group (CP-PEI) has also been synthesized by the reaction of BPADA, m-phenylenediamine and 3,5-diaminobenzoic acid. The modified PEIs were used as toughening agent for diglycidyl ether of bisphenol-A epoxy resin which was cured with nadic methyl anhydride (NMA). Thermal properties, fracture toughness (KIC) and solvent resistance of toughened epoxy resin were measured. The KIC of epoxy resin containing 20 phr of AT-PEI was 2.88 MPaㆍm0.5 without sacrificing thermal properties. The KIC of epoxy resin which contained 20 phr of CP-PEI was 2.82 MPaㆍm0.5.

Keywords:modified polyetherimide;epoxy resin;fracture toughness

[References]

Sultan JN, McGrarry FJ, Polym. Eng. Sci., 13, 29 (1973)
Riew CK, Gillham JK, Rubber Modified Thermoset Resins, Advances in Chemistry Series 208, American chemical Society, Washington D.C., (1984)
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Bucknall CB, Gilbert AH, Polymer, 30, 213 (1989)
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Chen MC, Hourston DJ, Schafer FU, Huckerby TN, Polymer, 36(17), 3287 (1995)

[Referenced By]

[Related Articles]

[1] Sultan JN, McGrarry FJ, Polym. Eng. Sci., 13, 29 (1973)

[2] Riew CK, Gillham JK, Rubber Modified Thermoset Resins, Advances in Chemistry Series 208, American chemical Society, Washington D.C., (1984)

[3] Ting RY, Epoxy Resins, C.A.May, Editor, Marcel Dekker, New York (1988)

[4] Bucknall CB, Partidge IK, Polymer, 24, 639 (1983)

[5] Hedrick JL, Yilgor I, Jurek M, Hedrick JC, Wilkes GL, McGrath JE, Polymer, 32, 2020 (1991)

[6] Pak SJ, Lyle GD, Mercier R, McGrath JE, Polymer, 34, 885 (1993)

[7] IIjima T, Hiroka H, Tomoi M, J. Appl. Polym. Sci., 45, 709 (1992)

[8] Min BG, Stachurski ZH, Hodgkin JH, J. Appl. Polym. Sci., 50, 1511 (1993)

[9] Kishi H, Shi TB, Huang J, Yee AF, Proc. 4th Japan International SAMPE Symposium, 40 (1995)

[10] Bucknall CB, Gilbert AH, Polymer, 30, 213 (1989)

[11] Jung HS, Jang J, Shim JS, Polym.(Korea), 17(5), 513 (1993)

[12] Chen MC, Hourston DJ, Schafer FU, Huckerby TN, Polymer, 36(17), 3287 (1995)