The feasibility of wireless intra-chip interconnections is presented. Integrated antennas and transmitted electromagnetic waves properties are investigated via simulation and experimental results. Materials and metallization design impact on system performances is found critical. Their study leads to the definition of high-performance structures manufactured via standard dual damascene processes. As a result, excellent propagation characteristics are obtained with crosstalk effects between antenna and nearby lines of the same order with those of traditional interconnects, thus demonstrating the viability and economic interest of wireless interconnects. (c) 2005 Elsevier Ltd. All rights reserved.