화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Journal of Industrial and Engineering Chemistry, Vol.16, No.1, 130-139, January, 2010
DOI10.1016/j.jiec.2010.01.006  Export Citation
Humic acid-immobilized polymer/bentonite composite as an adsorbent for the removal of copper(II) ions from aqueous solutions and electroplating industry wastewater
T.S. Anirudhan†, and P.S. Suchithra
  • Department of Chemistry, University of Kerala, Kariavattom, Trivandrum 695 581, India
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In this study, humic acid (HA) was immobilized onto amine-modified polyacrylamide/bentonite composite (Am-PAA-B) which was prepared by direct intercalation polymerization technique and the product (HA-Am-PAA-B) was used as an adsorbent for the removal of copper(II) ions from aqueous solutions. The surface characteristics of bentonite, Am-PAA-B and HA-Am-PAA-B were investigated. The adsorbent behaved like a cation exchanger andmore than 99.0% Cu(II) ions’ removal was observed at the pH range 5.0-6.0. Kinetic and isotherm experiments showed that amount of Cu(II) ions adsorbed increases with increase of the initial concentration and temperature. The adsorption kinetic data were interpreted by pseudo-first-order and pseudo-second-order rate equations. The suitability of Langmuir, Freundlich and Dubinin-Radushkevich (D-R) adsorption models to the equilibrium data was investigated. The Langmuir isotherm was found to provide the best theoretical correlation of the experimental equilibrium data. The thermodynamic and kinetic activation parameters were derived to predict the nature of adsorption process and discussed in detail. The isosteric heat of adsorption was constant even after increase in surface loading. The removal efficiency of HA-Am-PAA-B was tested using electroplating industry wastewater. The desorption of adsorbed Cu(II) ions was achieved by 0.1 M HCl and four adsorption/desorption cycles were performed without significant decrease in the adsorption capacity.
Keywords:Humic acid;Polymer/clay composite;Copper(II) adsorption;Isotherm;Thermodynamics
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