| 초록 |
Portable electronic devices, most notably mobile phones, become smaller and slimmer in design and integrate more functionality. For printed circuit boards (PCBs), it translates into smaller size and higher density. Under these circumstances, major consumer electronics makers set reliability standards with more severe conditions, calling on suppliers to comply with them. Consequently, various approaches are being taken to find solutions for these requirements among suppliers. In particular, solder reflow temperature increases, requiring better thermal resistance of PCBs. In this study, insulating materials for PCBs in Handset application fields were manufactured by casting process using epoxy resin-blended solutions. The epoxy resin-blended solutions were prepared as function of various epoxy composition. After manufacturing PCB from insulating materials with the various epoxy composition, the thermal shock reliability test was conducted. |
