| 학회 |
한국화학공학회 |
| 학술대회 |
2006년 가을 (10/27 ~ 10/28, 고려대학교) |
| 권호 |
12권 2호, p.1414 |
| 발표분야 |
공업화학 |
| 제목 |
The Study on Performance of Copper Electroless Plating as PET Substrate at Higher than Critical Pressure |
| 초록 |
In this study, the conductive PET film by using electroless plating of a copper plating solution containing supercritical CO2 was prepared. The plating conditions were as follows. The copper plating solution of compositions as CuSO4∙5H2O = 6∼12 g/L, C4H4KNaO∙4H2O = 20∼50 g/L, and HCHO = 5∼12 g/L, respectively, at 15 MPa and pH 12.3. The copper plating was performed at 20∼30 ℃. The concentration ratio of CO2/copper bath, pressure, and temperature had an effect on dispersion property of a copper plating solution. Environmental and technical effects by using supercritical CO2 as a solvent in an electroless plating were observed as well. |
| 저자 |
이희대1, 김문선1, 김남기1, 윤상호2, 김철경2
|
| 소속 |
1성균관대, 2목원대 |
| 키워드 |
Electroless Plating; Copper Plating; Supercritical Fluid; PET Film
|
| E-Mail |
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| 원문파일 |
초록 보기 |
