| 학회 |
한국공업화학회 |
| 학술대회 |
2017년 봄 (05/10 ~ 05/12, 광주 김대중컨벤센센터(Kimdaejung Convention Center)) |
| 권호 |
21권 1호 |
| 발표분야 |
디스플레이 |
| 제목 |
Fast and Low-Temperature Curing Property based Mercaptan Hardener for IT device Adhesive |
| 초록 |
Epoxy adhesive is excellent mechanical quality after curing. For instance, it is superior in electrical insulation strength, thermal resistance and adhesion properties. In the IT area, Epoxy adhesive is used to utilize from large to small equipment. Especially, the heat sensitive material such as polymeric material is needed fast and low-temperature curing. In this paper, we studied the curing behaviors of Bisphenol A diglycidyl ether (DGEBA) with modified mercaptan hardener. We used mercaptan polymer with the number of –SH functional groups so that fast and low-temperature curing. The curing properties was analyzed by Differential Scanning Calorimetry (DSC) and Rheometer. |
| 저자 |
강호용, 임종태, 석웅철, 권세진, 강주희, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
Mercaptan; Hardener; Epoxy adhesive; curing behavior
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| E-Mail |
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