| 학회 |
한국공업화학회 |
| 학술대회 |
2017년 봄 (05/10 ~ 05/12, 광주 김대중컨벤센센터(Kimdaejung Convention Center)) |
| 권호 |
21권 1호 |
| 발표분야 |
디스플레이 |
| 제목 |
Curing characteristic of Silane-modified hardener for IT Epoxy Adhesive |
| 초록 |
Epoxy Adhesive used in assembling various electronic devices because of its superior thermal and mechanical properties. Especially if the device sensitive to heat, it is required for characterization fast and low-temperature curing. In this paper, we study a part of hardener in epoxy adhesive. The hardener were synthesized by sol-gel condensation reaction of (3-mercaptopropyl)-dimethoxysilane (MPDMS) or (3-mercaptopropyl)-trimethoxysilane (MPTMS) or trimethoxy(octyl)silane (TMOS) or diphenylsilanediol (DPSD). Hardeners were examined using Nuclear Magnetic Resonance (NMR), Fourier Transform Infrared spectroscopy (FT-IR). The thermal properties were investigated by Thermogravimetric analyzer (TGA). Curing behaviors were examined by Differential Scanning Calorimetry (DSC) at dynamic and isothermal conditions. |
| 저자 |
강호용, 임종태, 석웅철, 권세진, 강주희, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
Epoxy adhesive; Silane; Hardener; Curing
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| E-Mail |
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