검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Phase analysis of TaN/Ta barrier layers in sub-micrometer trench structures for Cu interconnects Traving M, Zienert I, Zschech E, Schindler G, Steinhogl W, Engelhardt A Applied Surface Science, 252(1), 11, 2005 |
| 2 |
Evaluation of circuit performance of ultra-thin-body SOICMOS Pacha C, Schmal A, Schulz T, Gottsche R, Steinhogl W Solid-State Electronics, 47(7), 1205, 2003 |
| 3 |
Electrical characterization of copper interconnects with end-of-roadmap feature sizes Schindler G, Steinlesberger G, Engelhardt M, Steinhogl W Solid-State Electronics, 47(7), 1233, 2003 |
| 4 |
Processing technology for the investigation of sub-50 nm copper damascene interconnects Steinlesberger G, Engelhardt M, Schindler G, Kretz J, Steinhogl W, Bertagnolli E Solid-State Electronics, 47(7), 1237, 2003 |
| 5 |
Quasi-Elastic Helium Atom Scattering Measurements of Microscopic Diffusion of Co on the Ni(110) Surface Bertino MF, Hofmann F, Steinhogl W, Toennies JP Journal of Chemical Physics, 105(24), 11297, 1996 |