1 |
Increased fracture depth range in controlled spalling of (100)-oriented germanium via electroplating Crouse D, Simon J, Schulte KL, Young DL, Ptak AJ, Packard CE Thin Solid Films, 649, 154, 2018 |
2 |
Free-standing epitaxial silicon thin films for solar cells grown on double porous layers of silicon and electrochemically oxidized porous silicon dioxide Lukianov A, Ihara M Thin Solid Films, 648, 1, 2018 |
3 |
Mechanically flexible nanoscale silicon integrated circuits powered by photovoltaic energy harvesters Shahrjerdi D, Bedell SW, Khakifirooz A, Cheng K Solid-State Electronics, 117, 117, 2016 |
4 |
Transfer of thin, patterned gold layers from poly(methyl methacrylate) stamp onto photoresist surface Lyutakov O, Tuma J, Janousek M, Huttel I, Svorcik V Thin Solid Films, 550, 459, 2014 |
5 |
Transfer of CuInS2 thin film by lift-off process and application to superstrate-type thin-film solar cells Abe Y, Osada S, Fukamizu S, Oda Y, Minemoto T, Nakanishi K, Ohta T, Takakura H Thin Solid Films, 520(17), 5640, 2012 |
6 |
Lift-off process reducing crack formation and its Cu(In,Ga)Se-2 thin film solar cell applications Abe Y, Minemoto T, Osada S, Takakura H Solar Energy, 85(9), 2101, 2011 |
7 |
Effect of ultrasonic frequency on electrochemical Si etching in porous Si layer transfer process for thin film solar cell fabrication Lee JY, Han WK, Lee JH Solar Energy Materials and Solar Cells, 95(1), 77, 2011 |
8 |
Lift-off of mesoporous layers by electrochemical etching on Si (100) substrates with miscut of 6 degrees off towards (111) Rojas EG, Terheiden B, Plagwitz H, Hensen J, Wiedemeier V, Berth G, Zrenner A, Brendel R Thin Solid Films, 520(1), 606, 2011 |
9 |
Solidly mounted BAW resonators with layer-transferred AlN using sacrificial Si surfaces Allah MA, Thalhammer R, Kaitila J, Herzog T, Weber W, Schmitt-Landsiedel D Solid-State Electronics, 54(9), 1041, 2010 |
10 |
Germanium on insulator near-infrared photodetectors fabricated by layer transfer Sorianello V, De Iacovo A, Colace L, Assanto G, Fulgoni D, Nash L, Palmer M Thin Solid Films, 518(9), 2501, 2010 |