Journal of the Electrochemical Society

Journal of the Electrochemical Society, Vol.148, No.3 Entire volume, number list

ISSN: 0013-4651 (Print)

In this Issue (61 articles)

L1 - L1	Effects of H-2 and/or O-2 plasma treatments on photoconductivity of freestanding polycrystalline diamond films (vol 147, pg 3935, 2000) Kim SH, Han IT, Kim YH, Kim TG, Kang SG, Lee SH, Moon SB, Kim DG
D19 - D23	Electrochemical reduction of cyanides at metallic cathodes - A comparison with biological HCN reduction Fedurco M, Sartoretti CJ, Augustynski J
D24 - D28	Use of a gas-diffusion electrode as anode in the electrochemical synthesis of L-cysteine Exposito E, Gonzalez-Garcia J, Garcia-Garcia V, Montiel V, Aldaz A
F43 - F46	Etching mechanism of silicon nitride in HF-based solutions Knotter DM, Denteneer TJJ
G95 - G98	Electrical characteristics and thermal stability of W, WNx, and TiN barriers in metal/Ta2O5/Si gate devices Lee JW, Han CH, Park JS, Park JW
G99 - G109	A model for mechanical wear and abrasive particle adhesion during the chemical mechanical polishing process Ahmadi G, Xia X
H21 - H27	AC impedance spectroscopy of humidity sensor using Poly(o-phenylenediamine)/poly(vinyl alcohol) composite film Ogura K, Tonosaki T, Shiigi H
A183 - A188	Investigation of the transversal water profile in nafion membranes in polymer electrolyte fuel cells Buchi FN, Scherer GG
A189 - A193	Amorphous tungsten oxide/ruthenium oxide composites for electrochemical capacitors Jeong YU, Manthiram A
A194 - A199	Intercalation mechanism of lithium ions into graphite layers studied by nuclear magnetic resonance and impedance experiments Kim YO, Park SM
A200 - A208	Mathematical models for time-dependent impedance of passive electrodes Yin Q, Kelsall GH, Vaughan DJ, Brandon NP
A209 - A219	Competitive adsorption reaction mechanism of Ni/yttria-stabilized zirconia cermet anodes in H-2-H2O solid oxide fuel cells Ihara M, Kusano T, Yokoyama C
A220 - A223	Reduction of irreversibility in the first charge of tin oxide thin film negative electrodes Nam SC, Yoon YS, Cho WI, Cho BW, Chun HS, Yun KS
A224 - A229	Optimized LiFePO4 for lithium battery cathodes Yamada A, Chung SC, Hinokuma K
A230 - A236	A high-rate manganese oxide for rechargeable lithium battery applications Doeff MM, Anapolsky A, Edman L, Richardson TJ, De Jonghe LC
A237 - A240	The effect of Co substitution for Ni on the structure and electrochemical behavior of T2 and O2 structure Li-2/3[COxNi1/3-xMn2/3]O-2 Lu ZH, Dahn JR
A241 - A248	Phase transitions in LaNi4Co during electrochemical cycling an in situ X-ray diffraction study Chartouni D, Gross K
A249 - A257	Li-6 magic angle spinning NMR study of the cathode material LiNixMn2-xO4 - The effect of Ni doping on the local structure during charging Lee YJ, Eng C, Grey GP
A258 - A266	A new layered vanadium oxide prepared by electrochemical transformation of a solid precursor Legagneur V, La Salle AL, Verbaere A, Piffard Y, Guyomard D
A267 - A274	Quaternary onium salts as nonaqueous electrolytes for electrochemical capacitors Xu K, Ding MS, Jow TR
A275 - A278	Thin film supercapacitors using a sputtered RuO2 electrode Lim JH, Choi DJ, Kim HK, Cho WI, Yoon YS
A279 - A283	Ionic conductivity of microporous PVDF-HFP/PS polymer blends Huang HT, Wunder SL
B111 - B115	Effect of an etching Ti substrate on a catalytic oxide electrode Kim KW, Lee EH, Kim JS, Shin KH, Kim KH
B116 - B120	Impedance evaluation of the effect of Ru0.3Ti0.7O2 on electrochemical properties of polymeric conducting electrodes used in cathodic protection Darowicki K, Janicki S
C131 - C135	Electroplated Cu and sputtered Ta crystallographic texture degradation in Cu/Ta/SiOF layered structures Lee KW, Lee S, Park JW
C136 - C144	Electrodeposited iron group thin-film alloys - Structure-property relationships Myung NV, Nobe K
C145 - C148	Shape evolution of electrodeposited bumps into deep cavities Hayashi K, Fukui K, Tanaka Z, Kondo K
C149 - C155	Low-pressure chemical vapor deposition of semi-insulating polycrystalline silicon thin films I. Experimental study and proposal of new kinetic laws Barathieu P, Caussat B, Scheid E, Jaume D, Couderc JP
C156 - C161	Low-pressure chemical vapor deposition of semi-insulating polycrystalline silicon thin films II. Theoretical local analysis of the process Barathieu P, Caussat B, Scheid E, Couderc JP
C162 - C167	Electroless deposition of thin-film cobalt-tungsten-phosphorus layers using tungsten phosphoric acid (H-3[P(W3O10)(4)]) for ULSI and MEMS applications Shacham-Diamand Y, Sverdlov Y, Petrov N
C168 - C176	Microstructure and giant magnetoresistance of electrodeposited Co-Cu/Cu multilayers Peter L, Cziraki A, Pogany L, Kupay Z, Bakonyi I, Uhlemann M, Herrich M, Arnold B, Bauer T, Wetzig K
C177 - C182	Selective Electrodeposition of micropatterns on predefined surface defects on p-Si(100) Schmuki P, Erickson LE, Champion G
C183 - C190	Electrodeposition and nucleation of copper at nitrogen-incorporated tetrahedral amorphous carbon electrodes in basic ambient temperature chloroaluminate melts Lee JJ, Miller B, Shi X, Kalish R, Wheeler KA
C191 - C196	An electrochemical analysis of thin silver films produced by reactive sputtering Djokic SS, Burrell RE, Le N, Field DJ
C197 - C202	Electron-beam induced nanomasking for metal electrodeposition on semiconductor surfaces Djenizian T, Santinacci L, Schmuki P
C203 - C210	Electrodeposition of CdTe from basic aqueous solutions containing ethylenediamine Murase K, Honda T, Yamamoto M, Hirato T, Awakura Y
C211 - C221	A review of SiO2 etching studies in inductively coupled fluorocarbon plasmas Schaepkens M, Oehrlein GS
C222 - C226	Effect of surface composition of electrochemically codeposited platinum/molybdenum oxide on methanol oxidation Wang Y, Fachini ER, Cruz G, Zhu Y, Ishikawa Y, Colucci JA, Cabrera CR
C227 - C230	Influence of deposition temperature on the microstructure of Pb-Ti-Nb-O thin films by metallorganic chemical vapor deposition Liu XD, Funakubo H, Noda S, Komiyama H
C231 - C235	Effects of cathodic hydrogen evolution on electrodeposited Au-Cu-Cd alloys Bozzini B, Cavallotti PL
C236 - C239	Sensitive end-point detection for dielectric etch Hudson EA, Dassapa FC
C240 - C246	Etch film and pit structure of AA1050 aluminum plates electrograined in nitric and hydrochloric acids Lin CS, Fu SM
C247 - C251	Selective deposition of diamond film on glass substrate via the enhancement of the diamond nucleation density by the cyclic process Kim SH, Kim TG, Kim YH, Kim DU, Lee SK, Hosomi T, Maki T, Kobayashi T
E105 - E111	Lead underpotential deposition on polycrystalline gold electrode in perchloric acid solution - A combined electrochemical quartz crystal microbalance and probe beam deflection study Henderson MJ, Bitziou E, Hillman AR, Vieil E
E112 - E117	Determination of nitrite and nitrogen oxides by anodic voltammetry at conductive diamond electrodes Spataru N, Rao TN, Tryk DA, Fujishima A
E118 - E120	Voltammetric study of an unusual dimer/monomer redox system involving a chromium(III) complex of a tridentate CNN ligand Leelasubcharoen S, Lehmann MW, Theopold KH, Evans DH
E121 - E126	Grain boundary blocking effect in zirconia: A Schottky barrier analysis Guo X, Maier J
E127 - E132	Kinetic investigation of the Ti-H system by a molten salt electrochemical technique Nishikiori T, Nohira T, Ito Y
G110 - G113	Defect photoluminescence of undoping ZnO films and its dependence on annealing conditions Lin BX, Fu ZX, Jia YB, Liao GH
G114 - G117	Electrical and structural properties of Ti/Au ohmic contacts to n-ZnO Kim HK, Han SH, Seong TY, Choi WK
G118 - G125	Controlled deposition of organic contamination and removal with ozone-based cleanings Claes M, De Gendt S, Kenens C, Conard T, Bender H, Storm W, Bauer T, Mertens P
G126 - G131	Electrical and compositional properties of co-silicided shallow p(+)-n junction using Si-capped/boron-doped Si1-xGex layer deposited by UHVCME Huang HJ, Chen KM, Chang CY, Huang TY
G132 - G136	Growth and characterization of SiC/SiNx/Si structures Nahm KS, Kim KC, Lim KY
G137 - G140	Stability of advanced photoresist systems for subquarter micrometer lithography during reactive ion etch processes Naeem MD, Yan W, Zhu J
G141 - G149	Evaluation of oxalyl fluoride for a dielectric etch application in an inductively coupled plasma etch tool Karecki S, Chatterjee R, Pruette L, Reif R, Sparks T, Beu L, Vartanian V, Novoselov M
G150 - G155	Surface damage in silicon substrates after the SiCl4 dry etch of a poly-Si film Susi E, Castaldini A, Cavalcoli D, Cvallini A
G156 - G158	A novel method of structure control in Si thin film technology Guliants EA, Anderson WA
G159 - G165	Modeling of reverse tone etchback shallow trench isolation chemical mechanical polishing Gan T, Tugbawa T, Lee B, Boning DS, Jang S
G166 - G171	Kinetic and diffusional aspects of the dissolution of Si in HF solutions van den Meerakker JEAM, Mellier MRL
G172 - G177	Fluctuation model of chemical mechanical planarization Sukharev V
G178 - G184	Infrared spectroscopic study of decomposition of Ti(N(CH3)(2))(4) Driessen JPAM, Schoonman J, Jensen KF