화학공학소재연구정보센터
Macromolecular Research, Vol.25, No.9, 936-943, September, 2017
Effects of Processing Methods on the Electrical Conductivity, Electromagnetic Parameters, and EMI Shielding Effectiveness of Polypropylene/Nickel-Coated Carbon Fiber Composites
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The effects of composite preparation methods on the electrical conductivities, the electromagnetic parameters and the electromagnetic interference (EMI) shielding effectiveness of polypropylene (PP)/nickel-coated carbon fiber (CF) composites were investigated. The composites were prepared by injection molding machine, internal mixer, and screw extruder. The electrical properties results showed the PP/CF (70/30, wt%) composites prepared by injection molding demonstrated the highest electrical conductivity and EMI shielding effectiveness, which were 1.75×10 1 S/cm and 48.4 dB at the frequency of 10 GHz, respectively. These results seem mainly due to the increased CF length when the PP/CF composite was prepared by injection molding, which was advantageous in forming a conductive network of the composite. The results of the electromagnetic parameters of the PP/CF composites showed that the increased electrical conductivity of the composite prepared by injection molding was mainly due to the increased dielectric constants (ε' and ε") of the PP/ CF composite. This enhancement in dielectric constants seems related to the percolation at a lower concentration of the CF, which was affected by the increased CF length of the composite prepared by injection molding process. The results of dielectric loss and magnetic loss factors of the PP/CF composite showed that the major electromagnetic absorbing mechanism was dielectric loss, namely dipole polarization and interface polarization between filler and matrix, which resulted in improved EMI absorption values. The total EMI shielding effectiveness (SE T) of the PP/CF composite comprised 85.1% EMI shielding effectiveness by absorption (SE A), and 14.9% EMI shielding effectiveness by reflection (SE R), which suggests that the EMI shielding was predominantly by the absorbing mechanism of the incident electromagnetic wave.
  1. Shahzad F, Alhabeb M, Hatter CB, Anasori B, Hong SM, Koo CM, Gogotsi Y, Science, 353(6304), 1137 (2016)
  2. Frey AH, Health Perspect, 106, 101 (1998)
  3. Wang H, Ma N, Yan Z, Deng L, He J, Hou Y, Jiang Y, Yu G, Nanoscale, 7, 7189 (2015)
  4. Ling Q, Sun J, Zhao Q, Zhou Q, Mater. Sci. Eng. B-Solid State Mater. Adv. Technol., 162, 162 (2009)
  5. Zhao N, Zou T, Shi C, Li J, Guo W, Mater. Sci. Eng. B-Solid State Mater. Adv. Technol., 127, 207 (2006)
  6. Ameli A, Jung PU, Park CB, Carbon, 60, 379 (2013)
  7. Abbas N, Kim HT, Macromol. Res., 24(12), 1084 (2016)
  8. Salimbeygi G, Nasouri K, Shoushtari AM, Malek R, Mazaheri F, Macromol. Res., 23(8), 741 (2015)
  9. Chaudhary A, Kumari S, Kumar R, Teotia S, Singh BP, Singh AP, Dhawan SK, Dhakate SR, ACS Appl. Mater. Interfaces, 8, 10600 (2016)
  10. Arjmand M, Apperley T, Okoniewski M, Sundararaj U, Carbon, 50, 5126 (2012)
  11. Al-Saleh MH, Jawad SA, El Ghanem HM, High Perform. Polym., 26, 205 (2013)
  12. Kim SK, Lee JW, Hong IK, Lee S, Macromol. Res., 22(2), 154 (2014)
  13. Yoon SW, Lee S, Choi IS, Do Y, Park S, Macromol. Res., 23(8), 713 (2015)
  14. Lee M, Koo J, Ki H, Lee KH, Min BH, Lee YC, Kim JH, Macromol. Res., 25(3), 231 (2017)
  15. Jang WI, Lee JW, Baek YM, Park OO, Macromol. Res., 24(3), 276 (2016)
  16. Shahzad F, Kumar P, Kim YH, Hong SM, Koo CM, ACS Appl. Mater. Interfaces, 8, 9361 (2016)
  17. Kumar P, Shahzad F, Yu S, Hong SM, Kim YM, Koo CM, Carbon, 94, 494 (2015)
  18. Kim JM, Kim DH, Kim J, Lee JW, Kim WN, Macromol. Res., 25(2), 190 (2017)
  19. Jang MG, Lee YK, Kim WN, Macromol. Res., 23(10), 916 (2015)
  20. Lim SJ, Lee JG, Hur SH, Kim WN, Macromol. Res., 22(6), 632 (2014)
  21. Lee SH, Cho E, Jeon SH, Youn JR, Carbon, 45, 2810 (2007)
  22. Shahzad F, Yu S, Kumar P, Lee JW, Kim YH, Hong SM, Koo CM, Compos. Struct., 133, 1267 (2015)
  23. Xu Y, Li Y, Hua W, Zhang A, Bao J, ACS Appl. Mater. Interfaces, 8, 24131 (2016)
  24. Yu S, Lee JW, Han TH, Park C, Kwon Y, Hong SM, Koo CM, ACS Appl. Mater. Interfaces, 5, 11618 (2013)
  25. Zhao HB, Fu ZB, Chen HB, Zhong ML, Wang CY, ACS Appl. Mater. Interfaces, 8, 1468 (2016)
  26. Zhao B, Guo X, Zhao W, Deng J, Shao G, Fan B, Bai Z, Zhang R, ACS Appl Mater Interfaces, 8, 28917 (2016)
  27. Zeng J, Xu J, J. Alloy. Compd., 493, 39 (2010)
  28. Shen G, Xu Z, Li Y, J. Magn. Magn. Mater., 301, 325 (2006)
  29. Qu B, Zhu C, Li C, Zhang X, Chen Y, ACS Appl. Mater. Interfaces, 8, 3730 (2016)
  30. Liu J, Che R, Chen H, Zhang F, Xia F, Wu Q, Wang M, Small, 8, 1214 (2012)
  31. He JZ, Wang XX, Zhang YL, Cao MS, J. Mater. Chem., 4, 7130 (2016)
  32. Xu J, Liu J, Che R, Liang C, Cao M, Li Y, Liu Z, Nanoscale, 9, 5782 (2014)
  33. Yoo TW, Lee YK, Lim SJ, Yoon HG, Kim WN, J. Mater. Sci., 49(4), 1701 (2014)
  34. Park DH, Lee YK, Park SS, Lee CS, Kim SH, Kim WN, Macromol. Res., 21(8), 905 (2013)
  35. Jang MG, Cho C, Kim WN, J. Compos. Mater, 51, 1005 (2017)
  36. Lu G, Li X, Jiang H, Compos. Sci. Technol., 56, 193 (1996)
  37. Heo GY, Hong YT, Park SJ, Macromol. Res., 20(5), 503 (2012)
  38. Yuan B, Yu L, Sheng L, An K, Zhao X, J. Phys. D-Appl. Phys., 45, 235108 (2012)
  39. Paul CR, Introduction to Electromagnetic Compatibility, 2nd ed., Wiley Interscience, Hoboken, NJ, 2006.
  40. Thomassin JM, Jerome C, Pardoen T, Bailly C, Huynen I, Detrembleur C, Mater. Sci. Eng. R-Rep., 74, 211 (2013)
  41. Qin F, Brosseau C, J. Appl. Phys., 111, 61301 (2012)
  42. Potschke P, Dudkin SM, Alig I, Polymer, 44(17), 5023 (2003)
  43. Nakamura T, J. Appl. Phys., 88, 348 (2000)
  44. Wang C, Han X, Xu P, Zhang X, Du Y, Hu S, Wang J, Wang X, Appl. Phys. Lett., 98, 72906 (2011)
  45. Li N, Huang Y, Du F, He X, Lin X, Gao H, Ma Y, Li F, Chen Y, Eklund PC, Nano Lett., 6, 1141 (2006)
  46. Ott HW, Electromagnetic Compatibility Engineering, Wiley, New York, 2009.