은이 코팅된 Copper(I) Oxide 나노 입자 및 도전성 페이스트의 제조 특성

박승우; 손재홍; 심상보; 최연빈; 배동식; Seung Woo Park; Jae Hong Son; Sang Bo Sim; Yeon Bin Choi; Dong Sik Bae

Korean Journal of Materials Research, Vol.29, No.1, 37-42, January, 2019

DOI10.3740/MRSK.2019.29.1.37 Export Citation

은이 코팅된 Copper(I) Oxide 나노 입자 및 도전성 페이스트의 제조 특성

Fabrication and Characterization of Silver Copper(I) Oxide Nanoparticles for a Conductive Paste

박승우^{1, 2}, 손재홍¹, 심상보¹, 최연빈², 배동식^{2, †}

¹창성나노텍㈜
²국립 창원대학교 신소재공학과

Seung Woo Park^{1, 2}, Jae Hong Son¹, Sang Bo Sim¹, Yeon Bin Choi², and Dong Sik Bae^{2, †}

¹ChangSung Nanotech. Co., Ltd, Kimhae 50969, Republic of Korea
²School of Nano & Advanced Materials Engineering, Changwon National University, Changwon 51140, Republic of Korea

E-mail:

This study investigates Ag coated Cu2O nanoparticles that are produced with a changing molar ratio of Ag and Cu2O. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and Cu2O determination, and SEM image analysis confirms that Ag is partially coated on the surface of Cu2O nanoparticles. The conductive paste with Ag coated Cu2O nanoparticles approaches the specific resistance of 6.4 Ω·cm for silver paste(SP) as (Ag) /(Cu2O) the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of 100 μm or less has a surface resistance of 5 to 20 μΩ·cm, while in this research an Ag coated Cu2O paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of 10 μm or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

Keywords:paste;copper oxide;silver;nanoparticle;electrical properties

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[1] Lee HS, Jeong HS, Seo JH, Park JC, KIC News, 12, 23 (2009)

[2] Mai LX, Wang DW, Zhang S, Xie YJ, Huang CM, Zhang ZG, Appl. Surf. Sci., 257(3), 974 (2010)

[3] Su W, Wei SS, Hu SQ, Tang JX, J. Hazard. Mater., 172(2-3), 716 (2009)

[4] Kim YJ, Li Z, Kim DH, Lee DW, Ahn JH, J. Ceram. Process. Res., 10, 216 (2009)

[5] Jin JH, Chu MC, Cho SJ, Bae DS, Trans. Nonferrous Met. Soc., 19, 96 (2009)

[6] Park HR, Lee SW, Yoo IS, Appl. Chem. Eng., 23(3), 293 (2012)

[7] Gandomani SK, Yousefi R, Jamali-Sheinic F, Huang NM, Ceram. Int., 40, 7957 (2014)

[8] Jamil NY, Najim SA, Muhammed AM, Rogoz VM, Proc. Int. Conference., 3, 3 (2014)

[9] Gayathri S, Ghosh OSN, Sathishkumar S, Sudhakara P, Jayaramudu J, Ray SS, Viswanath AK, Appl. Sci. Lett., 1, 8 (2015)

[10] Yang X, Xu L, Yu X, Guo Y, Maynurkader, Catal. Commun., 9, 1607 (2008)

[11] Zhang H, Chen G, Environ. Sci. Technol., 43, 2905 (2009)

[12] Chao HE, Yun YU, Xingfang HU, Larbot A, J. Eur. Ceram. Soc., 23, 1457 (2003)

[13] Akhavan O, J. Colloid Interface Sci., 336(1), 117 (2009)

[14] Akpan UG, Hameed BH, Appl. Catal. Gen., 375, 1 (2010)

[15] Hou XM, Zhang XL, Chen ST, Fang Y, Yan JL, Li N, Qi PX, Appl. Surf. Sci., 257(11), 4935 (2011)

[16] Yonezawa Y, Kometani N, Sakaue T, Yano A, J. Photochem. Photobiol chem., 171, 1 (2005)

[17] Meyer M, Wallberg C, Kurihara K, Fendler JH, J. Chem. Soc., Chem. Commun., 2, 90 (1984)

[18] Boutonnet M, Kizling J, Stenius P, Maire G, Colloids Surf., 5, 209 (1982)

[19] Ghanbary F, Jafarian A, J. Basic Appl. Sci., 5, 2889 (2011)

[20] Bohren CF, Huffman DR, John Wiley & Sons, Inc., New York, (1988).

[21] Zhang L, Yu JC, Catal. Commun., 6, 684 (2005)

[22] Li M, Wang J, Damoiseaux R, Environ. Sci. Technol., 45, 8989 (2011)

[23] Alistan-Grijalva A, Herrera-Urbina R, Physica. E., 25, 438 (2005)

[24] Pan L, Li L, Chen Y, Micro Nano Lett., 6, 1019 (2011)

[25] Roberson DA, Wicker RB, Murr LE, Church K, Macdonald E, Materials, 4, 963 (2011)