고성능 에폭시/폴리썰폰 블렌드의 열적 성질

윤태성; 이두성

Polymer(Korea), Vol.21, No.2, 215-221, March, 1997

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고성능 에폭시/폴리썰폰 블렌드의 열적 성질

Thermal Properties of High Performance Epoxy/Polysulfone Blends

윤태성, 이두성

초록

고성능 에폭시/폴리썰폰 (EP/PSF) 블렌드의 열적 성질을 DSG, FT-IR, DMA 및 TGA를 사용하여 조사하였다. PSF함량이 증가할수록 경화반응이 느려졌고 경화반응 중의 에테로화반응이 적게 일어났다. 또한, 경화온도가 220℃로 높을 때, 에폭시의 열분해가 많았지만, 높은 T_g 점도를 갖는 PSF의 첨가에 의해 열분해가 억제되었다. 따라서 가교된 에폭시의 최종 T_g 감소를 억제시켰다. 한편, 경화온도가 180℃로 낮았을 때, 에폭시의 에테르화는 거의 일어나지 않았다. 또한, EP-리치 상의 최종 T_g 감소도 보이지 않았다. 이는 균일한 가교밀도를 갖은 가교된 에폭시가 얻어졌기 때문이라 생각된다. 경화온도가 낮아질수록, PSF함량이 증가할수록, 계의 열안정성이 증가하였다.

Thermal properties of high performance epoxy/polysulfone (EP/PSF) blends were investigated by DSC, FT-IR, DMA, and TGA. With increasing the PSF content, the rate of cure reaction and the etherification was decreased during cure reaction. When the cure temperature was high, 220 ℃, the thermal degradation of epoxy by the etherification reaction was large, but this degradation was suppressed by adding PSF having high Tg and viscosity. Consequently, the crosslinked epoxy was suppressed the decrease of final Tg. When the cure temperature was low, 180 ℃, the etherification of epoxy was little occurred. Also the decrease of final Tg of EP-rich phase did not shown. It seems that the crosslinked epoxy was obtained to have the homogeneous crosslinking density. The thermal stability of system was increased by increasing the PSF content and by lowering the cure temperature.

Keywords:cure reaction;etherification;thermal degradation;thermal stability

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[3] Hagnauer GL, Pearce PG, Laliberte BR, Roylance ME, Am. Chem. Soc. Org. Coat. Appl. Polym. Sci. Proc., 47, 429 (1982)

[4] May CA, Ousi MR, Fritzn JS, Hadad DK, Maximovigh MG, Thraser KS, Am. Chem. Soc. Org. Coat. Appl. Polym. Sci. Proc., 47, 419 (1982)

[5] Oacanin JM, Cizmecidglu M, Tsay F, Gupta A, Am. Chem. Soc. Org. Coat. Appl. Polym. Sci. Proc., 47, 587 (1982)

[6] Monse ET, Walkup CM, Happe JA, Morgan RJ, Proceeding of the 14th National SAMPE Technical Conference, Atlranta, GA, Oct., 89 (1982)

[7] Morgan RJ, Happe JA, Monse ET, Paper Represented at the 28th National SAMPE Technical Symposium, Anaheim, Calif., April, 12 (1982)

[8] Mijovic J, Kim J, Slaby J, J. Appl. Polym. Sci., 29, 1449 (1982)

[9] Mijovic J, J. Appl. Polym. Sci., 31, 1177 (1986)

[10] Browning CE, Polym. Eng. Sci., 18, 16 (1978)

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[12] Apicella A, Nicolais L, Astarita G, Drioli E, Polymer, 20, 1143 (1979)

[13] Yamanaka K, Inoue T, J. Mater. Sci., 25, 241 (1990)

[14] Bucknall CB, Patridge IK, Polymer, 24, 639 (1983)

[15] Bucknall CB, Patridge IK, Polym. Eng. Sci., 26, 54 (1986)

[16] Raghava RS, J. Polym. Sci. B: Polym. Phys., 25, 1017 (1987)

[17] Bucknall CB, Gilbert AH, Polymer, 30, 213 (1989)

[18] Yamanaka K, Inoue T, Polymer, 30, 662 (1989)

[19] Hourston DJ, Lane JM, Polymer, 33, 1379 (1992)

[20] Kim BS, Chiba T, Inoue T, Polymer, 34, 2809 (1993)

[21] Gomez CM, Bucknall CB, Polymer, 34, 2111 (1993)

[22] Bucknall CB, Gomez CM, Quintard I, Polymer, 35(2), 353 (1994)

[23] Ahmad ZB, Ashby MF, Beaumont PWR, Scr. Mettal., 843 (1986)

[24] Farber KT, Evans AG, Acta Mettal., 31, 565 (1983)

[25] Evans AG, Phil. Mag., 26, 1327 (1972)

[26] Lee DS, Youn T, Park YH, Kim J, Polym.(Korea), 18(5), 754 (1994)

[27] Yoon T, Kim BS, Kim J, Lee DS, Polym.(Korea), 20(3), 403 (1996)

[28] Yoon T, Kim BS, Kim J, Lee DS, Polym.(Korea), 20(3), 412 (1996)

[29] Lee DS, Kim YS, Park BL, Kim JW, J. Appl. Polym. Sci., 59(10), 1639 (1996)

[30] Kim BS, Inoue T, Polymer, 36(10), 1985 (1995)