Macromolecular Research, Vol.20, No.5, 465-472, May, 2012
Electrical, Thermal, and Rheological Properties of Carbon Black and Carbon Nanotube Dual Filler-Incorporated Poly(dimethylsiloxane) Nanocomposites
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Conductive nano-sized carbon black (CB) and carbon nanotube (CNT) are widely used in the polymer industry due to their excellent electrical and thermal conduction behavior and reinforcing ability. Herein, poly(dimethylsiloxane) (PDMS) nanocomposites filled with both conductive CB and CNT were fabricated using a planetary mixer and two-roll mill. Due to excellent thermal, electrical, and physical properties of CB and CNT, both the thermal and electrical properties of the composites and the dynamic mechanical properties were improved by the incorporation of CB and CNT into PDMS. The thermal conductivities of the composites linearly increased with filler concentration, and the electrical threshold was determined to be low. The rheological properties of the PDMS/CB and PDMS/CB/CNT nanocomposites were significantly influenced by filler incorporation.
- Kim KS, Park SJ, Carbon Lett., 11, 102 (2010)
- Bae DY, Lee HS, Carbon Lett., 11, 83 (2010)
- Park EJ, Lee JW, Jung DS, Shim SE, Elastom.Compos., 45, 17 (2010)
- Lee J, Park JH, Shim SE, Elastom. Compos., 45, 7 (2010)
- Mather PJ, Thomas KM, J. Mater. Sci., 32(2), 401 (1997)
- King JA, Gaxiola DL, Johnson BA, Keith JM, J.Compos. Mater., 44, 839 (2010)
- Koszkul J, Mater. Sci., 35, 82 (1999)
- Oh WC, Ko WB, Zhang FJ, Elastom. Compos., 45, 80 (2010)
- Shim YS, Park SJ, Carbon Lett., 11, 311 (2010)
- Ramasubramaniam R, Chen J, Liu H, Appl. Phys. Lett., 83, 2928 (2003)
- Chae DW, Hong SM, Macromol. Res., 19(4), 326 (2011)
- Bonnet P, Sireude D, Garnier B, Chauvet O, Appl.Phys. Lett., 201910/1, 91 (2007)
- Lu CS, Mai YW, J. Mater. Sci., 43(17), 6012 (2008)
- Xu Y, Leong CK, Chung DDL, J. Electron. Mater., 36, 1181 (2007)
- Biercuk MJ, Llaguno MC, Radosavljevic M, Hyun JK, Johnson AT, Appl. Phys. Lett., 80, 2767 (2002)
- Viswanath R, Wakharkar V, Watwe A, Lebonheur V, Intel Technol. J., Q3, 1 (2000)
- Bryning MB, Milkie DE, Islam MF, Kikkawa M, Yodh AG, Appl. Phys. Lett., 161909/1, 87 (2005)
- Huang H, Liu CH, Wu Y, Fan SS, Adv. Mater., 17(13), 1652 (2005)
- Song PC, Liu CH, Fan SS, Appl. Phys. Lett., 153111/1, 88 (2006)
- Hong WT, Tai NH, Diam. Relat. Mater., 17, 1577 (2008)
- Liu CH, Fan SS, Appl. Phys. Lett., 123106/1, 86 (2005)
- Yu A, Itkis ME, Bekyarova E, Haddon RC, Appl.Phys. Lett., 133102/1, 89 (2006)
- Hong J, Lee J, Hong CK, Shim SE, Curr. Appl. Phys., 10(1), 359 (2010)
- Xu WJ, Kranzz M, Kim SH, Allen MG, J. Micromech. Microeng., 20 (2010)
- Baac HW, Ok JG, Park HJ, Ling T, Chen SL, Guo LJ, Appl. Phys. Lett., 234101/1, 97 (2010)
- Fabris D, Rosshirt M, Cardenas C, Wilhite P, Patrick Y, Toshishige Y, Cary Y, J. Electron Packaging., 020902/1, 133 (2011)
- Lee J, Choi J, Hong J, Jung D, Shim SE, Synth. Met., 1030, 160 (2010)
- Ounaies Z, Park C, Wise KE, Siochi EJ, Harrison JS, Compos. Sci. Technol., 63, 1637 (2003)
- Sumita M, Sakata K, Asai S, Miyasaka K, Nakagawa H, Polym. Bull., 25, 265 (1991)
- Lee B, Liu JZ, Sun B, Shen CY, Dai GC, Express Polym. Lett., 2, 357 (2008)
- Shim SE, Isayev AI, Rheol. Acta, 43(2), 127 (2004)
- Jakab E, Omastova M, J. Anal. Appl. Pyrolysis., 74, 204 (2005)
- Zhang J, Feng SY, Ma QY, J. Appl. Polym. Sci., 89(6), 1548 (2003)
- Hong J, Lee J, Jung D, Shim SE, Thermochim. Acta, 512(1-2), 34 (2011)
- Song YS, Youn JR, Carbon., 43, 1378 (2005)
- Shaw MT, Macknight WJ, Introduction to Polymer Viscoelasticity, John Wiley & Sons, Inc., Hoboken (2005)
- Hsich HSY, J. Mater. Sci., 17, 438 (1982)