화학공학소재연구정보센터
검색결과 : 4건
No. Article
1 Chemical-Vapor-Deposition of Copper from Cu-I Hexafluoroacetylacetonate Trimethylvinylsilane for Ultralarge Scale Integration Applications
Braeckelmann G, Manger D, Burke A, Peterson GG, Kaloyeros AE, Reidsema C, Omstead TR, Loan JF, Sullivan JJ
Journal of Vacuum Science & Technology B, 14(3), 1828, 1996
2 Enhanced Chemical-Vapor-Deposition of Copper from (Hfac)Cu(Tmvs) Using Liquid Coinjection of Tmvs
Petersen GA, Parmeter JE, Apblett CA, Gonzales MF, Smith PM, Omstead TR, Norman JA
Journal of the Electrochemical Society, 142(3), 939, 1995
3 Characterization of Thin Copper-Films Grown via Chemical-Vapor-Deposition Using Liquid Coinjection of Trimethylvinylsilane and (Hexafluoroacetylacetonate) Cu (Trimethylvinylsilane)
Parmeter JE, Petersen GA, Smith PM, Apblett CA, Reid JS, Norman JA, Hochberg AK, Roberts DA, Omstead TR
Journal of Vacuum Science & Technology B, 13(1), 130, 1995
4 Chemical Additives for Improved Copper Chemical-Vapor-Deposition Processing
Norman JA, Roberts DA, Hochberg AK, Smith P, Petersen GA, Parmeter JE, Apblett CA, Omstead TR
Thin Solid Films, 262(1-2), 46, 1995