2717 - 2736 |
Vibrational spectroscopy of interfaces by infrared-visible sum frequency generation Buck M, Himmelhaus M |
2737 - 2740 |
Impression of high voltage pulses on substrate in pulsed laser deposition Ikegami T, Nakao M, Ohsima T, Ebihara K, Aoqui S |
2741 - 2750 |
Video analysis of inclusion induced macroparticle emission from aluminum sputtering targets Wickersham CE, Poole JE, Fan JS, Zhu L |
2751 - 2761 |
Spectroscopic study of plasma using zirconium tetra-tert-butoxide for the plasma enhanced chemical vapor deposition of zirconium oxide Cho BO, Lao S, Sha L, Chang JP |
2762 - 2766 |
Development of tin oxide synthesis by plasma-enhanced chemical vapor deposition Robbins JJ, Alexander RT, Bai M, Huang YJ, Vincent TL, Wolden CA |
2767 - 2772 |
Measurements of the critical inclusion size for arcing and macroparticle ejection from aluminum sputtering targets Wickersham CE, Poole JE, Leybovich A, Zhu L |
2773 - 2778 |
Plasma immersion ion cleaning of oxidized steel surfaces using hexafluoroethane and argon plasmas Peters AM, Nastasi M |
2779 - 2784 |
Crystallization kinetics in amorphous (Zr0.62Al0.38)O-1.8 thin films van Dover RB, Lang DV, Green ML, Manchanda L |
2785 - 2790 |
Modeling of the slip flow in the spiral grooves of a molecular pump Tsui YY, Kung CP, Cheng HP |
2791 - 2799 |
Direct correlation of x-ray photoelectron spectroscopy and Fourier transform infrared spectra and images from poly(vinyl chloride)/poly(methyl methacrylate) polymer blends Artyushkova K, Wall B, Koenig J, Fulghum JE |
2800 - 2804 |
Spectroscopic ellipsometry measurements of chromium nitride coatings Aouadi SM, Mihut DM, Kuruppu ML, Kirkpatrick SR, Rohde SL |
2805 - 2816 |
Estimates of differential sputtering yields for deposition applications Stepanova M, Dew SK |
2817 - 2819 |
Deposition of amorphous and microcrystalline silicon using a graphite filament in the hot wire chemical vapor deposition technique Morrison S, Madan A |
2820 - 2825 |
Influence of ion stimulated gas desorption from residual gas analyzer on partial pressure measurement Kurokouchi S, Kato S |
2826 - 2830 |
Sound velocity and Young's modulus in plasma deposited amorphous hydrogenated carbon Dillon RO, Ali A, Ianno NJ, Ahmad A, Furtak T |
2831 - 2834 |
Study on the characteristics of TiAlN thin film deposited by atomic layer deposition method Koo J, Lee JW, Doh T, Kim Y, Kim YD, Jeon H |
2835 - 2839 |
Deposition of diamond films at low pressure in a planar large-area microwave surface wave plasma source Yeh WY, Hwang J, Wu TJ, Guan WJ, Kou CS, Chang H |
2840 - 2845 |
Initial growth step and annealing effect of Ta2O5 formed by anodization of Ta foil in an ammonium tartrate electrolyte Ahn KS, Sung YE |
2846 - 2850 |
A new look at the steel cord-rubber adhesive interphase by chemical depth profiling Hammer GE |
2851 - 2855 |
Ion kinetic energy control in dual plasma deposition of thin films Wang LP, Tang BY, Gan KY, Tian XB, Chu PK |
2856 - 2865 |
Studies of mid-frequency pulsed dc biasing Kelly PJ, Hall R, O'Brien J, Bradley JW, Henderson P, Roche G, Arnell RD |
2866 - 2869 |
Dynamics and thermal stability of Cs superstructures on a Pt(111) surface Kondo T, Kozakai H, Sasaki T, Yamamoto S |
2870 - 2878 |
Structural and optical properties of thin lead oxide films produced by reactive direct current magnetron sputtering Venkataraj S, Geurts J, Weis H, Kappertz O, Njoroge WK, Jayavel R, Wuttig M |
2879 - 2883 |
Fabrication and characterization of C implantation standards for Si1-x-yGexCy alloys Laursen T, Chandrasekhar D, Hervig RL, Mayer JW, Smith DJ, Jasper C |
2884 - 2888 |
Micromachined piezoresistive cantilever array with integrated resistive microheater for calorimetry and mass detection Abedinov N, Grabiec P, Gotszalk T, Ivanov T, Voigt J, Rangelow IW |
2889 - 2892 |
Steady-state direct-current plasma immersion ion implantation using a multipolar magnetic field electron cyclotron resonance plasma source Zeng XC, Tong HH, Fu RKY, Chu PK, Xu ZJ, Chen QC |
2893 - 2899 |
Wall-dependent etching characteristics of organic antireflection coating in O-2+halogen/hydrogen halide plasma Xu SL, Lill T, Podlesnik D |
2900 - 2904 |
Analytic expressions of the speed factor for turbomolecular pumps Chang YW, Jou RY |
2905 - 2909 |
Effect of substrate-film lattice mismatch in La0.7Ba0.3MnO3-delta thin films for transport properties Hayashi K, Ohta E, Wada H |
2910 - 2919 |
Real-time/in situ diffraction study of phase and microstructural evolution in sputtered beta-Ta/Ta2O5 films Whitacre JF, Yalisove SM, Bilello JC |
2920 - 2924 |
Diamond-based composite layers as protective coatings for ion beam extraction systems Terranova ML, Sessa V, Piccirillo S, Rossi M, Valeri S, Materassi M |
2925 - 2930 |
Influence of the elemental composition and crystal structure on the vacuum properties of Ti-Zr-V nonevaporable getter films Benvenuti C, Chiggiato P, Mongelluzzo A, Prodromides A, Ruzinov V, Scheuerlein C, Taborelli M, Levy F |
2931 - 2935 |
Photocatalytic, antifogging mirror Takagi K, Makimoto T, Hiraiwa H, Negishi T |
2936 - 2940 |
Application of magnetic neutral loop discharge plasma in deep silica etching Chen W, Sugita K, Morikawa Y, Yasunami S, Hayashi T, Uchida T |
2941 - 2945 |
Reaction of gas-phase atomic hydrogen with NO on Ru(001) Kim TW, Weiss MJ, Hagedorn CJ, Weinberg WH |
2946 - 2957 |
Gas-phase studies in inductively coupled fluorocarbon plasmas Schaepkens M, Martini I, Sanjuan EA, Li X, Oehrlein GS, Perry WL, Anderson HM |
2958 - 2962 |
Inner surface coating of TiN by the grid-enhanced plasma source ion implantation technique Liu B, Zhang GL, Cheng DJ, Liu CZ, He R, Yang SZ |
2963 - 2967 |
Characteristics of a taper-seal type gasket for the Conflat (R) sealing system Kurokouchi S, Morita S, Okabe M |
2968 - 2973 |
Investigation of diamond film deposition on steel without and with ion beam nitriding pretreatment Shang NG, Lee CH, Zhou XT, Meng FY, Chan CY, Lee ST, Bello I |
2974 - 2978 |
Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene) Lee WH, Ko YK, Byun IJ, Seo BS, Lee JG, Reucroft PJ, Lee JU, Lee JY |
2979 - 2981 |
Preferential resputtering phenomenon on the surface of (100)-oriented Ni-Pt films: Effect of substrate bias during sputter deposition Shi J, Zhou R, Hashimoto M |
2982 - 2986 |
Reduction of artifacts in temperature programmed desorption measurements of field generated, real-life, powered samples Smentkowski VS, Linsebigler AL |