아크릴 도전사와 폴리프로필렌 섬유로 된 혼섬 슬라이버를 사용한 전자파 차폐용 복합재료의 새로운 제조 방법

홍성돈; 김지훈; 김영호; Seong Don Hong; Ji Hoon Kim; Young Ho Kim

Polymer(Korea), Vol.42, No.6, 994-1004, November, 2018

DOI10.7317/pk.2018.42.6.994 Export Citation

아크릴 도전사와 폴리프로필렌 섬유로 된 혼섬 슬라이버를 사용한 전자파 차폐용 복합재료의 새로운 제조 방법

A Novel Method for Manufacturing Electromagnetic Interference Shielding Composites by Using Blend Slivers of Electro-conductive Acrylic Fiber and Polypropylene Fiber

홍성돈, 김지훈, 김영호^{1, †}

국방기술품질원 전력지원체계연구센터
¹숭실대학교 유기신소재·파이버공학과

Seong Don Hong, Ji Hoon Kim, and Young Ho Kim^{1, †}

Forces Support Systems Research Center, Defense Agency for Technology and Quality, Jinju-si, Kyungsangnam-do 52851, Korea
¹Department of Organic Materials and Fiber Engineering, Soongsil University, Dongjak-gu, Seoul 06978, Korea

E-mail:

초록

플라스틱과 금속을 사용하는 기존 전자파 차폐용 복합소재 제조 시의 무게 증가와 충전재의 배향성을 높이기 어려운 문제점을 해결하기 위하여, 융점이 낮으면서 기계적 성질이 우수한 폴리프로필렌(PP) 섬유와 용융되지 않는 도전성(ec) 아크릴 섬유를 혼합한 혼섬 슬라이버를 제조한 후 이를 용융압착함으로써 간단하면서도 효율적으로 도전성 섬유가 매트릭스 내에 기계방향으로 배향된 전자파 차폐용 복합체를 제조하는 새로운 방법을 개발하였다. ec-아크릴 섬유와 PP 섬유의 혼합 비율을 달리한 혼섬 슬라이버를 준비하고 이로부터 ec-아크릴 섬유/PP 복합체 필름들을 제조한 후 이들의 물성, 표면특성, 전자파 차폐성 등을 분석하였다. 분석 결과, ec-아크릴 섬유는 복합체 내에서 기계 방향으로 배향되어 있으며, ec-아크릴 섬유의 함량을 20%로 하면서 복합필름의 두께를 1.6 mm 정도로 하면 1.0 GHz 영역에서 30 dB 이상의 우수한 전자파 차폐효율을 나타내었다.

In order to overcome the problems of increasing weight of composites and difficulty of orientation of the fillers in the matrix when plastic matrices and metal fillers were used for electromagnetic interference (EMI) shielding materials, a new simple and effective method was developed to produce EMI shielding composites in which electroconductive (ec-) fiber fillers were oriented to machine direction by using of melt-pressing mixed fiber slivers composed of meltable polypropylene (PP) fibers and non meltable ec-acrylic fibers. Ec-acrylic fiber/PP composite films with various contents of ecacrylic fiber were prepared from the mixed fiber slivers, and their mechanical and surface properties, resistivity, and electromagnetic shielding efficiency (EMSE) were analyzed. Results showed that ec-acrylic fibers were present parallel to machine direction in the composites and that an excellent EMSE of 30 dB at 1 GHz was obtained when composite films of 1.6 mm thickness with a 20 wt% ec-acrylic fiber content was used.

Keywords:polypropylene fiber;electro-conductive acrylic fiber;mixed sliver;melt pressing;composite;electromagnetic Shielding efficiency

[References]

Ahn TH, J. Kor. Soc. Cloth. Ind., 1, 7 (1999)
Park KY, Lee SE, Lee WJ, Kim CG, Han JH, Compos. Res., 19, 1 (2006)
Song MK, Hong SM, Park JM, Polym. Sci. Technol., 12, 689 (2001)
Tzeng SS, Chang FY, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 302, 258 (2001)
Roh JS, Chi YS, Kang TJ, Nam SW, Text. Res. J., 78, 825 (2008)
Cheng KB, Ramakrishna S, Lee KC, J. Thermoplast. Compos., 13, 378 (2000)
Shin KM, Sim CU, Lee JS, Kim YC, Polym. Korea, 41(3), 524 (2017)
Lee SH, Kim JY, Koo CM, Kim WN, Macromol. Res., 25(9), 936 (2017)
Park DH, Lee YK, Park SS, Lee CS, Kim SH, Kim WN, Macromol. Res., 21(8), 905 (2013)
Gaal PS, Thermitus MA, Stroe D, J. Therm. Anal. Calorim., 78, 185 (2004)
Santos WN, Polym. Test, 26, 556 (2007)
Lee BH, Kim HS, Lee SN, Kim HJ, Dorganc, JR, Compos. Sci. Tech., 69, 2573 (2009)
Chang YM, Lee JA, Park JH, Koh JS, Jung YJ, Kim SD, Text. Color. Finishing, 20, 53 (2008)
Guo B, Zhao SZ, Han GY, Zhang LW, Electrochim. Acta, 53(16), 5174 (2008)
Chen YH, Huang CY, Lai FD, Roan ML, Chen KN, Yeh JT, Thin Solid Films, 517(17), 4984 (2009)
Deng SB, Bai RB, Chen JP, J. Colloid Interface Sci., 260(2), 265 (2003)
http://www.hanilsf.co.kr/textile/textile_03.asp.
ASTM D257.07, Standard Test Methods for DC Resistance or Conductance of Insulating Materials (2014).
Yim YJ, Seo MK, Kim HY, Park SJ, Polym. Korea, 36(4), 494 (2012)
Santos WN, Mummery P, Wallwork A, Polym. Test, 24, 628 (2005)
Weidenfeller B, Hofer M, Schilling FR, Compos. Part A-Appl. Sci. Manuf., 35, 423 (2004)
Shimizu RN, Demarquette NR, J. Appl. Polym. Sci., 76(12), 1831 (2000)
Christensen A, Graham S, Appl. Therm. Eng., 29, 364 (2009)
Chung DDL, Appl. Therm. Eng., 21, 1593 (2001)
Byun SW, Park JK, Kim KY, Fiber Tech. Ind., 10, 33 (2006)
Im SS, Lee SB, Lee YM, Choi HK, J. Kor. Ind. Eng. Chem., 7, 424 (1996)
Chen HC, Lee KC, Lina JH, Compos. Pt. A-Appl. Sci. Manuf., 35, 1249 (2004)
Park KY, Lee SE, Kim CG, Han JH, Compos. Struct., 8, 401 (2007)
Tang Y, Liu L, Wu Y, Zhan H, Hu W, Mater. Lett., 61, 1307 (2007)
Cheng KB, Lee KC, Ueng TH, Mou KJ, Compos. Pt. A-Appl. Sci. Manuf., 33, 1219 (2002)
Boudenne A, Ibos L, Fois M, Majeste JC, Gehin E, Compos. Pt. A-Appl. Sci. Manuf., 36, 1545 (2005)
Han Z, Fina A, Prog. Polym. Sci, 36, 914 (2011)
Ishii H, Kobayashi N, Hirose K, Physica E, 40, 249 (2007)
Altunok M, Kureli I, Pulat M, Mater. Sci. Appl., 6, 519 (2015)
Hashan MM, Hasan KMF, Khandaker MFR, Karmaker KC, Deng Z, Zilani MJ, Int. J. Text. Sci., 6, 34 (2017)

[Referenced By]

[1] Ahn TH, J. Kor. Soc. Cloth. Ind., 1, 7 (1999)

[2] Park KY, Lee SE, Lee WJ, Kim CG, Han JH, Compos. Res., 19, 1 (2006)

[3] Song MK, Hong SM, Park JM, Polym. Sci. Technol., 12, 689 (2001)

[4] Tzeng SS, Chang FY, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 302, 258 (2001)

[5] Roh JS, Chi YS, Kang TJ, Nam SW, Text. Res. J., 78, 825 (2008)

[6] Cheng KB, Ramakrishna S, Lee KC, J. Thermoplast. Compos., 13, 378 (2000)

[7] Shin KM, Sim CU, Lee JS, Kim YC, Polym. Korea, 41(3), 524 (2017)

[8] Lee SH, Kim JY, Koo CM, Kim WN, Macromol. Res., 25(9), 936 (2017)

[9] Park DH, Lee YK, Park SS, Lee CS, Kim SH, Kim WN, Macromol. Res., 21(8), 905 (2013)

[10] Gaal PS, Thermitus MA, Stroe D, J. Therm. Anal. Calorim., 78, 185 (2004)

[11] Santos WN, Polym. Test, 26, 556 (2007)

[12] Lee BH, Kim HS, Lee SN, Kim HJ, Dorganc, JR, Compos. Sci. Tech., 69, 2573 (2009)

[13] Chang YM, Lee JA, Park JH, Koh JS, Jung YJ, Kim SD, Text. Color. Finishing, 20, 53 (2008)

[14] Guo B, Zhao SZ, Han GY, Zhang LW, Electrochim. Acta, 53(16), 5174 (2008)

[15] Chen YH, Huang CY, Lai FD, Roan ML, Chen KN, Yeh JT, Thin Solid Films, 517(17), 4984 (2009)

[16] Deng SB, Bai RB, Chen JP, J. Colloid Interface Sci., 260(2), 265 (2003)

[17] http://www.hanilsf.co.kr/textile/textile_03.asp.

[18] ASTM D257.07, Standard Test Methods for DC Resistance or Conductance of Insulating Materials (2014).

[19] Yim YJ, Seo MK, Kim HY, Park SJ, Polym. Korea, 36(4), 494 (2012)

[20] Santos WN, Mummery P, Wallwork A, Polym. Test, 24, 628 (2005)

[21] Weidenfeller B, Hofer M, Schilling FR, Compos. Part A-Appl. Sci. Manuf., 35, 423 (2004)

[22] Shimizu RN, Demarquette NR, J. Appl. Polym. Sci., 76(12), 1831 (2000)

[23] Christensen A, Graham S, Appl. Therm. Eng., 29, 364 (2009)

[24] Chung DDL, Appl. Therm. Eng., 21, 1593 (2001)

[25] Byun SW, Park JK, Kim KY, Fiber Tech. Ind., 10, 33 (2006)

[26] Im SS, Lee SB, Lee YM, Choi HK, J. Kor. Ind. Eng. Chem., 7, 424 (1996)

[27] Chen HC, Lee KC, Lina JH, Compos. Pt. A-Appl. Sci. Manuf., 35, 1249 (2004)

[28] Park KY, Lee SE, Kim CG, Han JH, Compos. Struct., 8, 401 (2007)

[29] Tang Y, Liu L, Wu Y, Zhan H, Hu W, Mater. Lett., 61, 1307 (2007)

[30] Cheng KB, Lee KC, Ueng TH, Mou KJ, Compos. Pt. A-Appl. Sci. Manuf., 33, 1219 (2002)

[31] Boudenne A, Ibos L, Fois M, Majeste JC, Gehin E, Compos. Pt. A-Appl. Sci. Manuf., 36, 1545 (2005)

[32] Han Z, Fina A, Prog. Polym. Sci, 36, 914 (2011)

[33] Ishii H, Kobayashi N, Hirose K, Physica E, 40, 249 (2007)

[34] Altunok M, Kureli I, Pulat M, Mater. Sci. Appl., 6, 519 (2015)

[35] Hashan MM, Hasan KMF, Khandaker MFR, Karmaker KC, Deng Z, Zilani MJ, Int. J. Text. Sci., 6, 34 (2017)