이중 가교로 제조한 보호필름용 무용제 UV 경화형 점착제

장동규; 이배화; 류성호; 이강영; 박동협; 윤근병; Dong Gyu Jang; Bae Hwa Lee; Seong Ho Ryu; Gang-Young Lee; Dong Hyup Park; Keun-Byoung Yoon

Polymer(Korea), Vol.46, No.3, 348-354, May, 2022

DOI10.7317/pk.2022.46.3.348 Export Citation

이중 가교로 제조한 보호필름용 무용제 UV 경화형 점착제

Solvent-free UV-curable Adhesives for a Protective Film by Double Cross-linking

장동규, 이배화¹, 류성호², 이강영², 박동협^{2, †}, 윤근병 ^†

경북대학교 고분자공학과
¹숭실대학교 안전보건융합공학과
²한국건설생활환경시험연구원 고분자소재센터

Dong Gyu Jang, Bae Hwa Lee¹, Seong Ho Ryu², Gang-Young Lee², Dong Hyup Park^{2, †}, and Keun-Byoung Yoon^†

Department of Polymer Science & Engineering, Kyungpook National University, Daegu 41566, Korea
¹Department of Safety and Health Convergence Engineering, Soongsil University, Seoul 06978, Korea
²Applied Polymer Research Center, Korea Conformity Laboratories, Incheon 21594, Korea

E-mail:,

초록

외부 충격이나 스크래치로부터 기능 및 상품성을 보호하기 위해 제품 표면에 보호필름을 붙인 상태로 출하하 게 된다. 용매 타입 혹은 열경화형 조성물을 이용하여 보호필름용 점착제를 제조할 경우 위치별 점착 특성이 불균 일 하거나 박리성 저하로 인해 표면에 잔사가 발생하는 문제점이 존재한다. 본 연구에서는 점착제 내부의 가교 구 조 형성을 제어하여 높은 응집력의 무용제 UV 경화형 점착제 조성물을 제조하였고, 다관능 가교제 및 금속 킬레이 트제의 종류 및 함량에 따른 점착 물성의 경향성을 관찰하였다. 이중 가교구조를 갖는 점착제는 낮은 박리강도를 보임과 동시에 높은 유지력 및 전단강도를 나타냈으며, 이 결과로 피착제 표면에 잔사 없이 원활하게 박리됨을 확 인하였다. 추가적으로 레오미터를 활용한 UV 경화 거동 분석에서 신속하게 가교 구조가 형성되는 것을 확인하여, 이 시스템은 빠른 점착제 필름 제작 공정에 적용 가능할 것으로 기대된다.

Products such as mobile and display are mostly shipped with a protective film in order to prevent the product from external impacts or scratches. If pressure-sensitive adhesives (PSAs) for a protective film are solvent- or thermosetting types, it may cause non-uniform adhesive force or remain residue on a surface as the PSA film is removed. In this research, we studied on UV-curable adhesive formulation with a high cohesive property made through formation of cross-linking by adding various cross-linkers and metal chelates and found a correlation between formulation and adhesive properties. It was confirmed that the PSA having double cross-linking structure exhibited low peel strength, high shear strength/holding time and was smoothly removable from a surface without residues. As a result of analysis of the UV curing behavior utilizing the rheometer, additionally, the adhesive formulation is quickly cured under UV irradiation, which is suitable for high-speed adhesive process.

Keywords:pressure-sensitive adhesive;UV-curable;solvent-free;residue-free;cohesive

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Ryu CM, Pang BL, Kim HI, Park JW, Lee SW, Kim HJ, Kim KM, Polym. Korea, 36, 315 (2011)
Kim H, Kang M, Kim HI, Polym. Korea, 43, 559 (2019)
Kim SH, Wang HS, Lee SH, Bu SH, Song K, Polym. Korea, 42, 714 (2018)
Kim SH, Chang HS, Park S, Song K, Polym. Korea, 34, 469 (2010)
Jamaluddin J, Lee MC, J. Adhes. Sci. Technol., 27, 905 (2013)
Joo HS, Do HS, Park YJ, Kim HJ, J. Adhes. Sci. Technol., 20, 1573 (2006)
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[1] Czech Z, J. Appl. Polym. Sci., 97, 886 (2005)

[2] Czech Z, Int. J. Adhes. Adhes., 26, 414 (2006)

[3] Creton C, MRS Bull., 28, 434 (2003)

[4] Tobing SD, Klein A, J. Appl. Polym. Sci., 79, 2230 (2001)

[5] Shanks RA, Gower MD, J. Appl. Polym. Sci., 93, 2909 (2004)

[6] Gzech Z, Wesolowska M, Eur. Polym. J., 43, 3604 (2007)

[7] Taghizadeh SM, Ghasemi D, J. Appl. Polym. Sci., 120, 411 (2011)

[8] Industrial Adhesives. http://www.henkel-adhesives.com/cn/en/ products/industrial-adhesives.html (accessed Apr. 5, 2022).

[9] Adhesives and Sealants.(accessed Apr 5, 2022).

[10] Lin SB, Durfee LD, Ekeland RA, McVIE J, Schalau GK, J. Adhes. Sci. Technol., 21, 605 (2007)

[11] Benedek I, Pressure-Sensitive Design and Formulation, Application; CRC Press: New York, USA, 2006.

[12] Lee JH, Shim GS, Kim HJ, Kim Y, Polymer, 11, 1959 (2019)

[13] Aubrey DW, Welding GN, Wong T, J. Appl. Polym. Sci., 13, 2193 (1969)

[14] Czech Z, Eur. Polym. J., 40, 2221 (2004)

[15] Park YJ, Lim DH, Kim HJ, Sung IK, Int. J. Adhes. Adhes., 29, 710 (2009)

[16] Zhang X, He J, Yue L, Bai Y, Liu H, J. Appl. Polym. Sci., 136, 47310 (2018)

[17] Song J, Im M, Park J, Kim HI, Polym. Korea, 43, 316 (2019)

[18] Jamaluddin J, Lee MC, J. Adhes., 18, 134 (2017)

[19] Ryu CM, Pang BL, Kim HI, Park JW, Lee SW, Kim HJ, Kim KM, Polym. Korea, 36, 315 (2011)

[20] Kim H, Kang M, Kim HI, Polym. Korea, 43, 559 (2019)

[21] Kim SH, Wang HS, Lee SH, Bu SH, Song K, Polym. Korea, 42, 714 (2018)

[22] Kim SH, Chang HS, Park S, Song K, Polym. Korea, 34, 469 (2010)

[23] Jamaluddin J, Lee MC, J. Adhes. Sci. Technol., 27, 905 (2013)

[24] Joo HS, Do HS, Park YJ, Kim HJ, J. Adhes. Sci. Technol., 20, 1573 (2006)

[25] Dale WC, Paster MD, Haynes JK, J. Adhes., 31, 1 (1989)

[26] Czech Z, Wojciechowicz M, Eur. Polym. J., 42, 2153 (2006)