1 - 7 |
Electrical, optical and structural characteristics of indium-tin-oxide thin films deposited on glass and polymer substrates Kulkarni AK, Schulz KH, Lim TS, Khan M |
8 - 12 |
Optical scattering enhanced by silicon micromachined surfaces Kolesar ES, Bright VM, Sowders DM |
V - V |
Papers presented at the 24th International Conference on Metallurgical Coatings and Thin Films, San Diego, CA, USA, April 21-25, 1997 - Preface Givens JH, Matthews A, Mitterer C, Rohde SL |
13 - 18 |
Preparation of transparent conducting In4Sn3O12 thin films by DC magnetron sputtering Minami T, Takeda Y, Takata S, Kakumu T |
19 - 25 |
PML/oxide/PML barrier layer performance differences arising from use of UV or electron beam polymerization of the PML layers Affinito JD, Eufinger S, Gross ME, Graff GL, Martin PM |
26 - 30 |
The use of experimental design techniques to meet reflected color targets in pyrolytic low emissivity coatings Neuman GA, Stewart-Davis SL |
31 - 37 |
Sensitivity of variable angle spectroscopic ellipsometry to isotropic thin film properties Urban FK, Barton D |
38 - 41 |
Investigations on the structure of boron nitride films Fukarek W, Kruse O, Kolitsch A, Moller W |
42 - 49 |
Ellipsometric studies of thermally induced transformation phenomena in oxide films Rose A, Exarhos GJ |
50 - 55 |
Analysis of binary electrochromic tungsten oxides with effective medium theory von Rottkay K, Ozer N, Rubin M, Richardson T |
56 - 62 |
Spectroscopic characterization of processing-induced property changes in doped ZnO films Exarhos GJ, Rose A, Windisch CF |
63 - 67 |
Plasma enhanced chemical vapour deposition of silica thin films in an integrated distributed electron cyclotron resonance reactor Bulkin P, Bertrand N, Drevillon B, Rostaing JC, Delmotte F, Hugon MC, Agius B |
68 - 73 |
Post-deposition processing of low temperature PECVD silicon dioxide films for enhanced stress stability Haque MS, Naseem HA, Brown WD |
74 - 78 |
Morphology of dual beam ion sputtered films investigated by atomic force microscopy Lee CC, Hsu JC, Wei DT, Lin JH |
79 - 84 |
Electronic properties and impurity levels in filtered cathodic vacuum are (FCVA) amorphous silicon Bilek MMM, Milne WI |
85 - 89 |
Fabrication and characterization of spherical polycrystalline diamond emitter arrays Chen CF, Huang WH |
90 - 93 |
Photoresist characteristics of polyurea films prepared by vapor deposition polymerization Sato M, Iijima M, Takahashi Y |
94 - 100 |
Formation of cubic boron nitride by the reactive sputter deposition of boron Jankowski AF, Hayes JP, Makowiecki DM, McKernan MA |
101 - 106 |
A novel approach to deposition of cubic boron nitride coatings Konyashin I, Loeffler J, Bill J, Aldinger F |
107 - 112 |
Vibrational spectroscopy of mixed hexagonal-cubic boron nitride thin films Beghi MG, Bottani CE, Miotello A, Ossi PM |
113 - 117 |
Superhard coatings of CNx/ZrN multilayers prepared by DC magnetron sputtering Wu ML, Qian WD, Chung YW, Wang YY, Wong MS, Sproul WD |
118 - 125 |
Low-energy ion bombardment effects in reactive rf magnetron sputtering of carbon nitride films Kaltofen R, Sebald T, Weise G |
126 - 129 |
Preparation of a novel target material for carbon nitride film deposition Lu TR, Kuo CT, Chen TM |
130 - 134 |
The composition and bonding structure of CNx films and their influence on the mechanical properties Chowdhury AKMS, Monclus M, Cameron DC, Gilvarry J, Murphy MJ, Barradas NP, Hashmi MSJ |
135 - 140 |
Optical and mechanical properties of amorphous CN films Lee S, Park SJ, Oh SG, Kim WM, Bae JH, Cheong BK, Kim SG |
141 - 146 |
High pressure high power microwave plasma chemical vapor deposition of large area diamond films Naseem HA, Haque MS, Khan MA, Malshe AP, Brown WD |
147 - 153 |
About the growth of diamond crystals obtained by the combustion-flame method : use for coatings on large area substrates Le Huu T, Zaidi H, Paulmier D |
154 - 158 |
Optical emission spectroscopy of the plasma during microwave CVD of diamond thin films with nitrogen addition and relation to the thin film morphology Vandevelde T, Nesladek M, Quaeyhaegens C, Stals L |
159 - 162 |
Growth of flake-like diamond crystal using polymer precursor Sun Z, Shi X, Tay BK, Wang X, Sun Y |
163 - 167 |
An improved method for large-area oriented nucleation of diamond during bias process via hot-filament chemical vapor deposition Li X, Hayashi Y, Nishino S |
168 - 172 |
Analysis of intrinsic stress distribution in grains of high duality CVD diamond film by micro-Raman spectroscopy Vlasov II, Ralchenko VG, Obraztsova ED, Smolin AA, Konov VI |
173 - 177 |
Electrical properties of diamond-like nanocomposite coatings Venkatraman C, Goel A, Lei R, Kester D, Outten C |
178 - 185 |
Study for fabricating large area diamond single-crystal layers Findeling-Dufour C, Gicquel A |
186 - 190 |
Heat treatment of cathodic arc deposited amorphous hard carbon films Anders S, Ager JW, Pharr GM, Tsui TY, Brown IG |
191 - 194 |
Surface analysis and bioreactions of F and Si containing a-C : H Hauert R, Muller U, Francz G, Birchler F, Schroeder A, Mayer J, Wintermantel E |
195 - 198 |
Surface relaxation during plasma chemical vapor deposition of diamond-like carbon films, investigated by in-situ ellipsometry von Keudell A, Schwarz-Selinger T, Jacob W |
199 - 203 |
Growth conditions and properties of tetrahedral amorphous carbon films Tay BK, Shi X, Cheah LK, Flynn DI |
204 - 208 |
Field emission from cleaved diamond fibers Glesener JW, Lin HB, Morrish AA |
209 - 214 |
Evaluation of buffer layers for hot filament chemical vapor deposition diamond films on silicon substrates Kumar A, You Q, Kapat JS, Mangiaracina A, Catletge A, Vohra Y |
215 - 218 |
Metallization of CVD diamond films by cathodic arc deposition Monteiro OR, Salvadori MC, Cattani M, Mammana V, Brown IG |
219 - 222 |
Low temperature plasma enhanced chemical vapour deposition boron nitride Carreno MNP, Bottecchia JP, Pereyra I |
223 - 227 |
Reactive magnetron sputtering of CNx thin films at different substrate bias Zheng WT, Broitman E, Hellgren N, Xing KZ, Ivanov I, Sjostrom H, Hultman L, Sundgren JE |
228 - 232 |
Production and characterisation of carbon nitride thin films produced by a graphite hollow cathode system Muhl S, Gaona-Couto A, Mendez JM, Rodil S, Gonzalez G, Merkulov A, Asomoza R |
233 - 238 |
Deposition of carbon nitride films by vacuum ion diode with explosive emission Korenev SA, Perry AJ, Elkind A, Kalmukov A |
239 - 244 |
Preparation of carbon nitride thin films by ion beam assisted deposition and their mechanical properties Kohzaki M, Matsumuro A, Hayashi T, Muramatsu M, Yamaguchi K |
245 - 248 |
Improving thickness uniformity of freestanding diamond sheets synthesized by the combustion flame method Murakawa M, Suzuki M, Takeuchi S |
249 - 253 |
Measurement of internal stresses in CVD diamond films Nakamura Y, Sakagami S, Amamoto Y, Watanabe Y |
254 - 257 |
Studies on CVD-diamond on Ti6Al4V alloy surface using hot filament assisted technique de Souza TM, Leite NF, Trava-Airoldi VJ, Corat EJ |
258 - 262 |
Study of porosity in permeable diamond membranes Mammana VP, Salvadori MC, Brown IG |
263 - 267 |
Structural dependence of mechanical properties of Si incorporated diamond-like carbon films deposited by RF plasma-assisted chemical vapour deposition Lee KR, Kim MG, Cho SJ, Eun KY, Seong TY |
268 - 272 |
Optical properties of tetrahedral amorphous carbon films determined by spectroscopic ellipsometry Tay BK, Shi X, Cheah LK, Flynn DI |
273 - 278 |
Application of heat treatment and dispersive strengthening concept in interlayer deposition to enhance diamond film adherence Lin CR, Kuo CT, Chang RM |
279 - 283 |
Investigation of distribution of defects and impurities in boron-doped CVD diamond film by cathodoluminescence spectroscopy Wang CL, Hatta A, Jiang N, Won JH, Ito T, Hiraki A, Jin ZS, Zou GT |
284 - 288 |
Optical characterization of nitrogenated carbon overcoats Chia RWJ, Li E, Sugi S, Li GG, Zhu H, Forouhi AR, Bloomer I |
289 - 296 |
Between nanoindentation and scanning force microscopy : measuring mechanical properties in the nanometer regime Baker SP |
297 - 303 |
Novel nanoindentation method for characterising multiphase materials Randall NX, Julia-Schmutz C, Soro JM, von Stebut J, Zacharie G |
304 - 309 |
Investigation of the elastic modulus of thin films using simple biaxial bending techniques Jamting AK, Bell JM, Swain MV, Schwarzer N |
310 - 314 |
A practical method for the determination of the Young's modulus and residual stresses of PVD thin films Tran MD, Poublan J, Dautzenberg JH |
315 - 322 |
Determination of the fatigue properties of multilayer PVD coatings on various substrates, based on the impact test and its FEM simulation Bouzakis KD, Vidakis N, Leyendecker T, Erkens G, Wenke R |
323 - 328 |
Bending stiffness measurements of magnetic tapes and substrates Scott WW, Bhushan B |
329 - 333 |
A comparative assessment of three approaches for ranking the adhesion of TiN coatings onto two steels Kuper A, Clissold R, Martin PJ, Swain MV |
334 - 339 |
Characterisation of TiN thin films using the bulge test and the nanoindentation technique Karimi A, Shojaei OR, Kruml T, Martin JL |
340 - 344 |
Nanotribology of ultrathin a : SiC/SiC-N overcoats using a depth sensing nanoindentation multiple sliding technique Scharf TW, Barnard JA |
345 - 350 |
Influence of surface integrity on performance of coated cutting tools Tonshoff HK, Blawit C |
351 - 357 |
A Mossbauer spectroscopy study of Ti-Fe interfaces produced by the PVD process Brooks JS, Davidson JL, Forder SD, Munz WD, Larsson M |
358 - 362 |
Materials characterization of Si1-x-yGexCy/Si superlattice structures Laursen T, Chandrasekhar D, Smith DJ, Mayer JW, Croke ET, Hunter AT |
363 - 368 |
Crystallization and residual stress formation of sol-gel-derived zirconia films Mehner A, Klumper-Westkamp H, Hoffmann F, Mayr P |
369 - 374 |
Applications of focused ion beam machining to the characterization of carbide, nitride and oxide films Presser N, Hilton MR |
375 - 381 |
Auger depth profiles and stud pull adhesion of metal films on graphite-epoxy composites Kraatz P, Lee TH, Weil L |
382 - 388 |
Elemental depth profiling of coated and surface-modified materials by GD-OES : hard coatings on cutting tools Weiss Z, Marshall K |
389 - 392 |
TEM specimen preparation and characterization of ceramic coatings on fiber tows Hay RS, Welch JR, Cinibulk MK |
393 - 398 |
Modification of a disordered Ni3Fe alloy surface by 50 keV Zr ion implantation Sharkeev YP, Perry AJ, Geist DE, Ryabchikov AI, Tailashev AS, Girsova NV, Kozlov EV |
399 - 405 |
The small angle cleavage technique applied to coatings and thin films Walck SD, McCaffrey JP |
406 - 409 |
Structural characterization of pulsed laser-deposited AlN thin films on semiconductor substrates Kumar A, Chan HL, Weimer JJ, Sanderson L |
410 - 414 |
A comparative study of refractory metal nitridation in an NH3 ambient Zou YL, Alford TL, Zeng YX, Laursen T, Ulrich BM |
415 - 419 |
A study of ion-bombarded nanostructures on germanium surfaces by scanning probe microscopy Chen YJ, Cheung WY, Wilson IH, Wong SP, Xu JB |
420 - 424 |
Structural inhomogeneities in thin epitaxial films of YBa2Cu3O7-delta and their effects on superconducting properties Qadri SB, Skelton EF, Broussard PR, Cestone VC, Osofsky MS, Browning VM, Reeves ME, Prusseit W |
425 - 429 |
Glow discharge optical spectroscopy depth profiles of ion implanted steel, titanium and titanium nitride coatings Seidel F, Stock HR, Mayr P |
430 - 435 |
Influence of electroless Ni-P deposits on the corrosion-fatigue properties of an AISI 1045 steel Chitty J, Pertuz A, Hintermann H, Staia MH, Puchi ES |
436 - 442 |
Thermal fatigue of hot work tool steel with hard coatings Starling CMD, Branco JRT |
443 - 447 |
Electromigration in 0.25 mu m wide Cu line on W Hu CK, Lee KY, Gignac L, Carruthers R |
448 - 454 |
Titanium-nitride self-encapsulation of Cu and Ag films on silicon dioxide Adams D, Laursen T, Alford TL, Mayer JW |
455 - 459 |
Metallization of sub-micron trenches and vias with high aspect ratio Siemroth P, Wenzel C, Klimes W, Schultrich B, Schulke T |
460 - 464 |
Characterization of Al-1 wt% Y thin films for VLSI interconnects Liu Y, Poole KF, Singh R, Harriss J, Diefendorf RJ |
465 - 469 |
Microstructures of copper thin films prepared by chemical vapor deposition Cho NI, Park DI |
470 - 474 |
Copper diffusion in organic polymer resists and inter-level dielectrics Godbey DJ, Buckley LJ, Purdy AP, Snow AW |
475 - 479 |
Heat resistant polyimide films with low dielectric constant by vapor deposition polymerization Ukishima S, Iijima M, Sato M, Takahashi Y, Fukada E |
480 - 485 |
Fundamental insight on developing low dielectric constant polyimides Simpson JO, St Clair AK |
486 - 489 |
The dissolution of copper in common solvents used for low dielectric polymers Purdy AP, Godbey D, Buckley L |
490 - 494 |
Application of SiO2 aerogel film with low dielectric constant to intermetal dielectrics Jo MH, Hong JK, Park HH, Kim JJ, Hyun SH, Choi SY |
495 - 500 |
Preparation and characterization of porous silica xerogel film for low dielectric application Hong JK, Yang HS, Jo MH, Park HH, Choi SY |
501 - 506 |
Stabilizing dielectric constant of fluorine-doped SiO2 film by N2O and NH3 plasma post-treatment Mei YJ, Chang TC, Chang SJ, Pan FM, Chen MSK, Tuan A, Chou S, Chang CY |
507 - 511 |
Deposition of stable, low kappa and high deposition rate SiF4-doped TEOS fluorinated silicon dioxide (SiOF) films Bhan MK, Huang J, Cheung D |
512 - 517 |
Cartesian coordinate maps for chemical mechanical planarization uniformity characterization Bibby TFA, Harwood R, Schey D, McKinley K |
518 - 522 |
Effects of corrosion environments on the surface finishing of copper chemical mechanical polishing Wang MT, Tsai MS, Liu C, Tseng WT, Chang TC, Chen LJ, Cheng MC |
523 - 528 |
Damascene copper interconnects with polymer ILDs Price DT, Gutmann RJ, Murarka SP |
529 - 532 |
Surface interaction forces in chemical-mechanical planarization Rajan K, Singh R, Adler J, Mahajan U, Rabinovich Y, Moudgil BM |
533 - 537 |
Stress distribution in chemical mechanical polishing Srinivasa-Murthy C, Wang D, Beaudoin SP, Bibby T, Holland K, Cale TS |
538 - 542 |
CMP CoO reduction : slurry reprocessing Bibby TFA, Adams JA, Holland K, Krulik GA, Parikh P |
543 - 549 |
Effects of underlying films on the chemical-mechanical polishing for shallow trench isolation technology Wang YL, Liu C, Feng MS, Dun JW, Chou KS |
550 - 554 |
Chemical-mechanical polishing of low-dielectric-constant spin-on-glasses : film chemistries, slurry formulation and polish selectivity Wang YL, Liu C, Chang ST, Tsai MS, Feng MS, Tseng WT |
555 - 561 |
Chemical-mechanical polishing as an enabling technology for giant magnetoresistance devices Hu YZ, Gutmann RJ, Chow TP, Bussmann K, Cheng SF, Prinz GA |
562 - 569 |
Dose-rate effects on the formation of ultra-shallow junctions with low-energy B+ and BF2+ ion implants Downey DF, Osburn CM, Cummings JJ, Daryanani S, Falk SW |
570 - 574 |
Reaction of amorphous Si with cobalt silicide before disilicide formation for reducing Si consumption in SIMOX Maa JS, Hsu ST, Ulrich B, Peng CH |
575 - 579 |
Edge leakage of cobalt silicided shallow junctions Peng CH, Maa JS, Hsu ST |
580 - 584 |
Synchrotron radiation characterization of metal silicide thin films : some observations Naftel SJ, Coulthard I, Sham TK, Xu DX, Erickson L, Das SR |
585 - 588 |
The effects of screen oxide and low temperature BPSG anneal on titanium salicide formation Lee KN, Ahn JG, Hwang H, Byun JS, Lee YJ |
589 - 593 |
Electrical properties of Ti/TiN films prepared by chemical vapor deposition and their applications in submicron structures as contact and barrier materials Hu J, Ameen M, Leusink G, Webb D, Hillman JT |
594 - 598 |
Characterization of TiN film grown by low-pressure-chemical-vapor-deposition Mei YJ, Chang TC, Hu JC, Chen LJ, Yang YL, Pan FM, Wu WF, Ting A, Chang CY |
599 - 606 |
A survey of ohmic contacts to III-V compound semiconductors Baca AG, Ren F, Zolper JC, Briggs RD, Pearton SJ |
607 - 610 |
Thermal stability of the non-alloyed Pd/Sn and Pd/Ge ohmic contacts to n-GaAs Islam MS, McNally PJ, Cameron DC |
611 - 614 |
Electrical and mechanical properties of MgO thin films on GaAs Soto R, Mergui S, Schmidt PE |
615 - 620 |
Some effects of temperature ramping on metal organic chemical vapor deposited Al film nucleation Yang D, Jonnalagadda R, Mahadev V, Cale TS, Hillman JT, Foster RF, Rogers BR |
621 - 626 |
Improved ozone-tetraethoxysilane oxide reliability for deep submicron inter-metal dielectric applications by deposition of a silane-based oxide underlayer Lin CF, Tseng WT, Chang YF, Feng MS |
627 - 633 |
Correlation of morphology and electrical properties of nanoscale TiSi2 epitaxial islands on Si (001) Yang W, Jedema FJ, Ade H, Nemanich RJ |
634 - 642 |
The characterization of etched GaAs surface with HCl or H3PO4 solutions Kang MG, Sa SH, Park HH, Suh KS, Oh KH |